Motor Control IC Market to Grow 5.0 Percent Through 2027

January 25, 2019 Brandon Lewis

Future Market Insights’ “Motor Control IC Market: Global Industry Analysis 2013-2017 and Opportunity Assessment 2018-2027” report projects that the motor control IC market will grow at a 5.0 percent CAGR through 2027 from a base of $3.905 billion in 2017. This equates to a total addressable market of $6.344 billion at the end of the forecast period, with growth driven by the use of motor control ICs in medical and automotive manufacturing equipment.

The Future Market Insights report categorizes motor control ICs as 32-bit embedded power motor control ICs, intelligent motor control ICs, and digital motor control ICs. Subcategories of the report include brushed DC motors, brushless DC motors, and stepper motors, of which brushed DC motors are estimated to currently hold 52.6 percent market share. Brushless DC motors are estimated to grow at a 6.0 percent CAGR through 2027, representing an incremental opportunity of $617.7 million.

The report also segments the motor control IC market by industry and region. Industries include automotive, building control, industrial automation, consumer electronics, healthcare, and others, with industrial automation projected to grow at a CAGR of 6.3% during the forecast period with an incremental opportunity of $644.9 million through 2027.

By region, North America is projected to maintain the largest market share with Europe growing at a 6.2 percent CAGR.

Companies addressed in Future Market Insights’ “Motor Control IC Market: Global Industry Analysis 2013-2017 and Opportunity Assessment 2018-2027” report include Infineon Technologies AG, Rockwell Automation, General Electric, ON Semiconductor, Siemens AG, Toshiba Corporation, ABB Ltd., Schneider Electric SE, Maxim Integrated, and NXP Semiconductors.

A sample of the report can be requested from www.futuremarketinsights.com/reports/sample/rep-gb-8184.

About the Author

Brandon Lewis

Brandon Lewis, Editor-in-Chief of Embedded Computing Design, is responsible for guiding the property's content strategy, editorial direction, and engineering community engagement, which includes IoT Design, Automotive Embedded Systems, the Power Page, Industrial AI & Machine Learning, and other publications. As an experienced technical journalist, editor, and reporter with an aptitude for identifying key technologies, products, and market trends in the embedded technology sector, he enjoys covering topics that range from development kits and tools to cyber security and technology business models. Brandon received a BA in English Literature from Arizona State University, where he graduated cum laude. He can be reached by email at brandon.lewis@opensysmedia.com.

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