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  • Ethernet TSN Accelerates Industry’s Digital Transformation

    Ethernet TSN Accelerates Industry’s Digital Transformation

    Ethernet Time-Sensitive Networking (TSN) has emerged as a solution for bridging enterprise and operational networks, from the data center to the control layer.

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  • CUI MEMS microphones provide improved audio quality & performance in compact, low-profile packages.

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  • DECT Forum Introduces openD for Wireless Software Development

    Market Launch Conference in Cooperation with Fraunhofer IIS Nuremberg.

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  • Arm to Present Arm Leading Edge at embedded world

    Arm has released Arm Leading Edge and will present it along with their partners at embedded world.

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  • F&S to Reveal PicoCore MX8MM at embedded world

    F&S released its 40 x 35mm PicoCore MX8MM module and will present it at embedded world.

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  • Hagiwara Solutions to Present new Products at embedded world 2019

    Hagiwara Solutions Co., Ltd. will appear at embedded world to present new products.

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  • Inforce Is Attending Embedded World 2019

    During the show, we'll give live demos of our newly launched product Inforce 6560 and also of Inforce 6640. Our other revolutionary products would also be available for static display.

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  • AKM’s AK4331ECB advanced, low-power, 32-bit stereo DAC includes a built-in amp and SRC.

    Get the Best Sound
  • Intrinsic ID at Embedded World 2019: Presentation on Secure IoT Device Management, Exhibit Partner with NXP and Renesas

    Intrinsic ID at Embedded World 2019: Presentation on Secure IoT Device Management, Exhibit Partner with NXP and Renesas.

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  • Why You Didn't Get the RTOS Business
    & Other Software Stories

    By Colin Walls
  • Connect Tech to Present two AI boards at Embedded World

    Connect Tech Inc. will be presenting the COM Express Type 7 + GPU Embedded System and the Rogue Carrier for NVIDIA Jetson AGX Xavier at Embedded World 2019.

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  • The IoT, Defined

    By Gene Frantz
  • Experts talk About Embedded Intelligence

    Embedded intelligence is becoming more and more relevant and is shaping an increasing number of systems.

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  • ADLINK To Present AI with Heterogeneous Computing at the Edge at Embedded World

    ADLINK Technology is providing heterogeneous computing platforms optimized for AI at the Edge to swiftly turn data into action at the point of generation.

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  • Compare Distributor Pricing & Part Availability

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  • Allied Vision to Present new Camera Series at Embedded World; Nominated for Award

    New camera series proposed for the Embedded Award in the Embedded Vision category at Embedded World.

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  • RISC-V Foundation to Highlight New Growth; Hosts Scavenger Hunt at Embedded World 2019

    The RISC-V Foundation booth will include live demonstrations from member companies Andes Technology, CloudBEAR, GreenWaves Technologies, Imperas Software, SiFive, Syntacore and UltraSoC.

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  • PEAK-System to Appear at embedded world 2019

    PEAK-System will present its latest products at embedded world 2019.

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  • OSS’ Bressner Will Appear at Embedded World 2019

    One Stop Systems, Inc.’s subsidiary, Bressner Technology GmbH will be attending Embedded World Exhibition & Conference.

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  • IAR DevCon – Free developer conference for embedded/IoT engineers. Coming to a city near you!

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  • San Francisco Circuits Updates Turnkey PCB Assembly Capabilities

    San Francisco Circuits (SFC) has updated its printed circuit board (PCB) turnkey assembly capabilities. Full turnkey PCB assembly through SFC reduces the customer's responsibility to source...

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  • Vicor’s Four New DC-DC Converter Chip Modules Hit the Market

    Vicor’s new 80W DCM ChiPs include a wide-input voltage range of 9V to 75V and are available with nominal output voltages of 12V, 24V, 28V and 48V.

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  • Renesas Electronics Employs KNX Protocol Over G3-PLC

    Renesas Electronics Corporation implemented KNX protocol on its G3-PLC solution.

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  • aicas and Klika Tech to Demonstrate Effective Realtime Voice-First Functionality at Embedded World

    Seamless Integration of Amazon Alexa Auto and aicas Realtime Technology Introduced as New Standard for Connected Vehicle Control

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  • Microchip’s PCIe 3.1 Ethernet Bridges Save Power for Embedded and Automotive Platforms

    Microchip Technology announced the LAN7430 and LAN7431 PCIe 3.1 Ethernet bridges with Low-Power Sub-State (LPSS) L1.1 and L1.2 for power savings.

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  • DiSTI Announces Partnership with Telechips

    DiSTI and Telechips partnership highlights GL Studio UI technology running on the Dolphin+ Hardware.

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