Uhnder and dSPACE Establish Cooperation for Radar Technology Development

April 21, 2020 Tiera Oliver

Uhnder and dSPACE have agreed to cooperate to ensure that the developments in radar sensor technology can keep pace with the safety requirements in traffic. Both companies will support each other in the continuous development of sensors and validation solutions. 

Uhnder has developed a digital Radar-on-Chip (RoC), using a combination of advanced CMOS and Digital Code Modulation (DCM) technology. Uhnder's 4D, digitally-modulated radar chip offers performance by integrating 192 virtual channels onto a single chip and pioneers High Contrast Resolution (HCR), which provides improved range and angular resolution and makes it possible to separate small radar reflectors from proximate large reflectors.

Throughout the development process, Uhnder relies on dSPACE Automotive Radar Target Simulators to subject sensors, whose signals are processed using this modulation method, to the most realistic tests possible until the sensors are approved for series production. 

Uhnder and dSPACE will present results of their partnership with demos at trade fairs. The first joint showcases will take place at the "International Conference on Microwave Intelligent Mobility 2020" in Linz (July 2020, exact date not fixed yet) and at the "European Microwave Week 2020" in Utrecht (September 13-18, 2020). 

For more information, visit: https://www.dspace.com/en/inc/home.cfm

About the Author

Tiera Oliver, edtorial intern for Embedded Computing Design, is responsible for web content edits as well as newsletter updates. She also assists in news content as far as constructing and editing stories. Before interning for ECD, Tiera had recently graduated from Northern Arizona University where she received her B.A. in journalism and political science and worked as a news reporter for the university's student led newspaper, The Lumberjack.

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