Embedded Computing Design

ALAMEDA, CA — Wind River® announced the latest release of Wind River Studio Developer, an edge-to-cloud DevSecOps platform designed to accelerate the development, deployment, and operation of mission-critical systems. The new enhancements and delivery models for Wind River Studio are designed to help software teams adopt cloud-native development capabilities that support DevSecOps approaches.

Rohde & Schwarz offers comprehensive test and measurement solutions to meet the challenges of diverse consumer electronics, telecommunications, industrial, medical, automotive, and aerospace applications, which must align with today’s efficiency, safety, reliability, and interoperability requirements. 

AVerMedia announced its participation in Embedded World 2024, inviting attendees to visit their booth at Hall 2-241 on April 9 to 11 in Nuremberg. The company will showcase its collaboration with several strategic partners, along with the revolutionary GenAI capabilities inherent in its ASVA service.

PLEASANTON, California – Alif Semiconductor announced the launch of the Balletto family, a Bluetooth® Low Energy (BLE) wireless microcontroller to feature hardware optimization for AI/ML workloads.

Austin, TX – Ambiq is introducing the new Apollo510, the first member of the Apollo5 SoC family, an MCU leveraging the Arm® Cortex®-M55 CPU with Arm Helium™ to reach processing speeds up to 250MHz.

San Diego, CA, congatec announced a new product family, aReady.COM, supporting the implementation of embedded and edge computing technology with the assistance of high-performance embedded building blocks, ranging from Computer-on-Modules (COM) to cloud.

Cadence Design Systems, Inc. expanded its Tensilica IP portfolio to address the increasing computational requirements associated with automotive sensor fusion applications. The new high-performance Cadence Tensilica Vision 331 DSP and Vision 341 DSP combine vision, radar, lidar and AI processing in a single DSP for multi-modal, sensor-based system designs, delivering energy efficiency in the small area.

Greater Los Angeles, California – Premio Inc. has added two new products to its family of Intel 11th Generation Elkhart Lake supported computers, the Modular Panel PC PC-100-EHL and IP69K Waterproof Computer WCO-3000-EHL. Now powered by the latest Intel 11th Generation (Elkhart Lake) processing technology, both products support enhanced compute performance and low power efficiency with an industrial-grade, ruggedized design.

DALLAS -- Texas Instruments (TI) introduced two new power conversion device portfolios to help engineers achieve more power in smaller spaces, and provide high power density at a low cost.

SANTA CLARA, Calif., -- AMD announced the launch of AMD Embedded+, a new architectural solution that combines AMD Ryzen™ Embedded processors with Versal™ adaptive SoCs onto a single integrated board to help ODM customers reduce qualification and build times by eliminating the need to expend additional hardware and R&D resources.

Munich, Germany and Tokyo, Japan –Infineon and Honda Motor Co., Ltd. have signed a Memorandum of Understanding (MoU) to build a strategic collaboration and align future product and technology roadmaps.

Hailo announced its new Hailo-15 family of high-performance vision processors, designed for direct integration into intelligent cameras for video processing and analytics at the edge.

BEIJING, China and SAN JOSE, Calif., USA –– Taifang Technology Co. Ltd. announced its Battery Intelligent Monitoring System (BIMS), leveraging the company’s elastic-wave technology, designed to monitor and report collisions electric-vehicle (EV) batteries may experience.

Louvain-La-Neuve, Belgium – At CES 2024, e-peas announced new members of its Ambient Energy Managers family optimized for Remote-Control Units (RCU) and Wireless Keyboard (KBD) design.

SANTA CLARA, Calif.— Ambarella, Inc. announced during CES the latest additions to its CV3-AD family of automotive AI domain controllers—the CV3-AD635 and CV3-AD655 systems-on-chip (SoCs).

WILMINGTON, MA – Heilind Electronics introduces the Hirose GT50 Series of compact wire-to-board connectors representing the latest in connector technology and designed to meet the demanding requirements of automotive internal connections and more.

Uppsala, Sweden– IAR announced version 9.50 of IAR Embedded Workbench for Arm and IAR Build Tools for Arm. The update includes enhancements like advanced cloud debugging and simulation capabilities on Linux, the integration of Arm Virtual Hardware (AVH), and the IAR C-SPY Debugger and Simulator for Linux.

SEOUL, South Korea - Magnachip Semiconductor Corporation announced the release of its 6th-generation 600V Super Junction Metal Oxide Semiconductor Field Effect Transistor (SJ MOSFET) built on the 180nm microfabrication process and Magnachip’s latest design technology

Together, Infineon and Eatron are helping electric vehicle (EV) manufacturers solve three technological challenges that have inhibited increasing customer adoption of EVs: range anxiety, charging speed, and battery health.

CALABASAS, CA. – Spirent Communications plc announced a collaboration with Cadence Design Systems, Inc., to deliver a joint networking system-on-chip (SoC) verification solution that bridges to link the divide between pre-silicon and post-silicon verification.