From February 27 to March 1, 2018 at the embedded world in Nuremberg (Hall 3, Stand 557), the POLYRACK TECH-GROUP will be presenting a variety of enclosure systems and customer-specific system applications from various industries and application areas including electronics integration and selection of HMI and MMI applications.
For the embedded sector, especially for industrial environments, POLYRACK presents the PanelPC 2 series. These IP54 Panel PC solutions are available in sizes from 10.1 "to 21.5" as well as in different material options from milled aluminum to sheet metal bending solutions. Resistive single-touch or multi-touch capacitive touchscreens (PCAP) with different glass thicknesses are available as user interfaces. Customized printing and anti-fingerprint coatings are available on request. In order to exploit the advantages of different materials, customers also have access to other technologies for material selection, such as plastic and cast iron - also in combination of materials.
Small Form Factor with EmbedTEC: The aluminum desktop case is the packaging for small form factors like embedded NUC (eNUC), pico-ITX (pITX, 2.5 "), SMARC, QSeven and SBCs like the Raspberry Pi. It has a replaceable I/O shield and a solid aluminum cover for heat dissipation, which can be replaced with a heat sink, perforated sidewalls, and fans to increase cooling performance as needed, and for automation and IoT applications, POLYRACK offers a wide range of customization and mounting options.
Other enclosure series such as SmarTEC for high-quality systems such as passively cooled mini-PCs, EmbedTEC for embedded computing and HMI applications as well as backplanes for the high-speed area with the VPX and CompactPCI Serial standards complete the portfolio of housing specialist POLYRACK. All solutions are characterized by an appropriate interaction of mechanics, plastics, electronics and the surface finish - tailored to the target market.