About the AuthorFollow on Twitter Follow on Linkedin Visit Website More Content by Rich Nass
- Embedded Technologies Expo
- Machine Learning
- Power Electronics
- Dev Tools & OS
- Dev Kit Selector
- Reference Designs
- White Papers
- Upcoming Activities & Events
ProLogium is a Taiwanese battery manufacturer making a big splash at CES 2018 with its solid-state Lithium ceramic battery (LCB) technology. As opposed to other flexible batteries based on liquids or gels that are prone to exploding or bursting, ProLogium LCBs provide a degree of ruggedness for use in applications such as wearables, industrial, and automotive.
At CES 2018, Rich Nass of Embedded Computing Design squeezed between onlookers at the ProLogium booth to get a better explanation of LCB technology from Sam Chang, the company's Product Marketing Manager.
Spectre and Meltdown: A new breed of vulnerability
The obvious way to eliminate Spectre/Meltdown vulnerabilities is eliminating the optimizations they exploit...
Compare Distributor Pricing & Part AvailabilityEnter Part Number
We also recommend:
TYAN Powers AI and HPC with 2nd Gen Intel® Xeon® Scalable Processor-based Server Platforms at ISC 2019
TYAN®, an industry-leading server platform design manufacturer and a MiTAC Computing Technology Corporation subsidiary, is showcasing its new 2nd gen Intel® Xeon® Scalable processor-based platforms.
TechInsights Announces In-depth Analysis of 9XL 3D NAND Semiconductor Solutions
TechInsights maintains the world’s largest database of semiconductor and advanced technology analysis.
c-treeEDGE IoT Database V2 launches with new features and integrations
Global database technology leader FairCom Corporation announced today the release ofc-treeEDGE IoT Database V2, which includes new features that increase flexibility for data management in edge comput
G.SKILL DDR4 Memory Achieves DDR4-5886 & 23 Overclocking Records During Computex 2019
G.SKILL International Enterprise Co., Ltd. is excited to announce that 23 overclocking records in various benchmark categories were broken during the Computex 2019 time frame.
Renesas Launches Low-Power Technology for Embedded Flash Memory Based on SOTB™ Process
Achieves read energy of 0.22 pJ/bit at 64 MHz – among the world’s lowest levels for embedded flash memory on an MCU.
Everspin 1 Gb STT-MRAM with DDR4 Interfaces Now in Pilot Production
The 1 Gb STT-MRAM devices will be available with 8- or 16-bit DDR4-compatible interfaces and designed into a JEDEC-compliant BGA package.
Renesas Releases 28 nm Flash Memory Technology
New technology achieves industry's largest capacity of embedded flash memory – 24 MB – and industry's fastest random access operation of 240 MHz.
Memory Card Standards Migrate Toward High Speed PCI Express
These standards with PCI Express interfaces give the two memory card standards a new life and opportunity in the future digital mass storage world.
Innodisk at Computex 2019: Where Storage Meets AIoT
Embedded Computing Design's Brandon Lewis sat down with Color Cheng, Senior Product Manager at Innodisk at Computex Taipei 2019.
Digi International Launches Digi ConnectCore 8X Development Kits
Purpose-built for demanding IoT environments, Digi ConnectCore 8X provides a complete and secure system platform to build connected intelligent devices.
Increasing Storage Requirements Drives More NAND into Automotive Designs
In order to keep costs at a minimum in the tight-margin automotive market, automakers and their suppliers are also using consumer-grade storage technologies.
Rugged SD Cards Made to Withstand Shock, Vibration, Write Cycles
SD cards are able to withstand shock and vibration better than less-durable forms of nonvolatile storage can, which explains their importance in protecting crucial data in demanding environments.
Toshiba's ARM Cortex-M4-Based Microcontrollers Deliver High-Speed Data Processing
Toshiba Electronics Europe added the M4G Group to its TXZ Family of ARM Cortex-M-based microcontrollers for office automation, audio-visual equipment, and industrial applications.
ICP Germany Develops Industrial 3D NAND SSD
The Titan T351 series from ICP Germany is a TLC SSD family that combines memory cells from Toshiba and firmware from Cervoz.
SEGGER Adds RAID5 to emFile File System
RAID5 delivers data integrity by providing a fail-safe layer on top of the CRC and/or error correction used by the underlying driver or storage medium.
Innodisk Displaying IoT-Ready Solutions and Resolution at IoT World 2019
Innodisk Introducing the Most Innovative AIoT Hardware Design for Industrial Applications
How to Remotely Reset Your Serial SPI Memory Device, and Why
The SPI is widely used to connect microcontrollers to peripherals and memory devices in embedded systems. In particular, it is frequently used for serial NOR flash that stores executable code.
Hyperstone NAND Flash Use Case Tracker Optimizes Memory Configuration, Management
The Use Case Tracker analyzes data from customer applications using a firmware extension to the Hyperstone’s hySMART tool, then recommends customized NAND Flash configurations based on the workload.
A Resilient Error Correction Scheme for 3D TLC NAND
Due to the complexity of 3D structures, several kinds of errors can occur. Especially in high-capacity systems, these issues require NAND flash controllers and advanced error correction algorithms.
Choosing a Relay: Go Newer Solid State or Older Electromechanical?