Octavo Systems Introduces First System in Package for STM32MP1 Family from STMicroelectronics

March 14, 2019 Rich Nass

These guys seem to be the masters at squeezing the most “stuff” into tiny packages. I’m referring to Octavo, the company that puts a complete system into a relatively small package, or SiP. Their latest offering is the OSD32MP1, which is based on the new STM32MP1 microprocessor from STMicroelectronics.

Octavo claims that the device is 64 percent smaller than an equivalent system made from discrete components. In fact, at 18 x 18 mm, the part is the same size as the STM32MP1 processor. But it adds a power-management IC, up to 1 Gbyte of DDR3 memory, 4 kbytes non-volatile EEPROM, and more than 100 passives in the BGA package.

ST’s STM32MP1 contains dual Arm Cortex-A7 processor cores along with a Cortex-M4 microcontroller. The peripheral set includes two 22-channel ADCs, a camera interface, and 1-Gbit/s Ethernet.

The beauty of the OSD32MP1 is that it lets users that are already designing with a part in the STM32 family to move to Linux without adding any size or complexity to their design. The inclusion of the M4 allows full reuse of the ST’s Cube firmware while adding support for Linux. That reuse makes it easier to port an application. Designing in a SiP rather than discrete components also reduces the PCB space needed and the connection of those discrete components, resulting in higher yields.

Samples will be available in Q3 with full production scheduled for Q4.

About the Author

Rich Nass

Richard Nass is the Executive Vice-President of OpenSystems Media. His key responsibilities include setting the direction for all aspects of OpenSystems Media’s Embedded and IoT product portfolios, including web sites, e-newsletters, print and digital magazines, and various other digital and print activities. He was instrumental in developing the company's on-line educational portal, Embedded University. Previously, Nass was the Brand Director for UBM’s award-winning Design News property. Prior to that, he led the content team for UBM Canon’s Medical Devices Group, as well all custom properties and events in the U.S., Europe, and Asia. Nass has been in the engineering OEM industry for more than 25 years. In prior stints, he led the Content Team at EE Times, handling the Embedded and Custom groups and the TechOnline DesignLine network of design engineering web sites. Nass holds a BSEE degree from the New Jersey Institute of Technology.

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