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  • Winmate Unveils 7" Rugged Arm-Based Tablet M700DQ8 with Qualcomm Snapdragon™ Processor

    Winmate Unveils 7" Rugged Arm-Based Tablet M700DQ8 with Qualcomm Snapdragon™ Processor

    Ideal for field data capture in nearly any industry and application.

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  • MYIR Introduces $29 ARM SoM Powered by ST STM32MP1

    MYIR Introduces $29 ARM SoM Powered by ST STM32MP1

    The MYC-YA157C CPU Module is a powerful and low-cost SoM for various embedded applications.

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  • STMicroelectronics Combines STM32 MCU and LoRa Transceiver on One SoC

    STMicroelectronics Combines STM32 MCU and LoRa Transceiver on One SoC

    STMicroelectronics introduced what it claims is the industry’s first LoRa system-on-chip (SoC). Previously, the LoRa device was a separate transceiver that connected to a microprocessor.

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  • Inside the Black Box

    Inside the Black Box

    Most software is obtained as a binary executable. The program may run and does what it does, but the user has no knowledge of its inner workings and has no opportunity to modify its functionality.

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  • TI’s Jacinto 7 Processors Enable Automotive ADAS and Gateway Applications

    TI’s Jacinto 7 Processors Enable Automotive ADAS and Gateway Applications

    Texas Instruments (TI) released a new series of microprocessors, the Jacinto 7 line. It was introduced at CES amid a series of demos.

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  • Analog and Digital Discovery Tools Address the Demands of Professional Engineers

    Analog and Digital Discovery Tools Address the Demands of Professional Engineers

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  • The IoT, Defined

    By Gene Frantz
  • D3 Engineering Launches Automotive Vision Development Kit Based on TI TDA4VM SoC

    D3 Engineering Launches Automotive Vision Development Kit Based on TI TDA4VM SoC

    The production-intent kit was designed to automotive temperature ranges and includes an automotive-grade power design with reverse battery protection, helping accelerate the design of ADAS systems.

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  • COM-HPC: Limitless High-Speed Scalability

    COM-HPC: Limitless High-Speed Scalability

    Scheduled for the first half of 2020, there is still some time to go before the final PICMG ratification of the COM-HPC specification.

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  • NXP Debuts i.MX Applications Processor with Neural Processing Unit for Advanced Machine Learning

    NXP Debuts i.MX Applications Processor with Neural Processing Unit for Advanced Machine Learning

    The new i.MX 8M Plus heterogeneous application processor with dedicated neural network accelerator, independent real-time sub-system, dual camera ISP, high-performance DSP and GPU for edge application

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  • NXP Unlocks Vehicle Data with the S32G Automotive Network Processors

    NXP Unlocks Vehicle Data with the S32G Automotive Network Processors

    Processors enable modern service-oriented gateways for rapid Over-the-Air (OTA) deployment of new capabilities and advanced edge-to-cloud analytics.

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  • QuickLogic to Show How Edge AI is Powering Next Generation Consumer Devices at CES 2020

    QuickLogic to Show How Edge AI is Powering Next Generation Consumer Devices at CES 2020

    QuickLogic, a developer of ultra-low power multi-core voice-enabled SoCs, embedded FPGA IP, and Endpoint AI solutions will be showcasing how its products enable AI-based voice control.

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  • Pervasive Displays' E-Paper Displays Address Demanding Applications

    Pervasive Displays' E-Paper Displays Address Demanding Applications

    The tri-color Electronic Paper Display modules offer high bi-stable images of at up to 134dpi

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  • Bluetooth SIG Releases LE Audio at CES

    Bluetooth SIG Releases LE Audio at CES

    The Bluetooth Special Interest Group will announce LE (low energy) Audio and True Wireless Stereo (TWS) at CES in las Vegas, Nevada.

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  • Rambus Announces PCI Express 5.0 Interface Solution

    Rambus Announces PCI Express 5.0 Interface Solution

    Rambus, a silicon IP and chip provider, announced it now offers a comprehensive and optimized interface solution designed for PCI Express (PCIe) 5.0, with backward compatibility to PCIe.

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  • Introduction to the SPI Interface

    Introduction to the SPI Interface

    This article provides a brief description of the 4-wire SPI interface followed by an introduction to SPI enabled switches and muxes that help reduce the number of digital GPIOs in system board design.

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  • Bridgetek Reveals Hardware Behind Its PanL Hub

    Bridgetek Reveals Hardware Behind Its PanL Hub

    Bridgetek has announced one of the pieces of hardware behind its PanL Smart Living and PanL Room Manager solutions.

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  • SEGGER's Ozone Debugger Now Supports Custom Instructions

    SEGGER's Ozone Debugger Now Supports Custom Instructions

    SEGGER announced the release of Ozone V3.10, a major update to its full-featured graphical debugger and performance analyzer.

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  • VadaTech Releases Xilinx Zynq UltraScale+ RFSoC FPGA Board

    VadaTech Releases Xilinx Zynq UltraScale+ RFSoC FPGA Board

    VadaTech, a manufacturer of integrated systems, embedded boards, announced the release of AMC573.

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  • Three Most Valuable Benefits that Encourage Companies to Adopt Serverless Architecture

    Three Most Valuable Benefits that Encourage Companies to Adopt Serverless Architecture

    According to Flexera’s RightScale 2019 State of the Cloud Report, serverless computing, for the second year in a row, is the top-growing cloud service with a 50% rise over 2018 (24 to 36% adoption).

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  • Mobiveil's PCI Express 4.0 Endpoint Controller Passes PCI-SIG Gold and Interoperability Testing

    Mobiveil's PCI Express 4.0 Endpoint Controller Passes PCI-SIG Gold and Interoperability Testing

    Configurable PCI Express Controller IP Certification Reduces Design Risk, Enables Interoperability with Other PCI Express Products

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