Processing

  • The Embedded Insiders' Initial Thoughts on Embedded World and a Return to Analog Computing

    The Embedded Insiders' Initial Thoughts on Embedded World and a Return to Analog Computing

    Embedded World 2020 is right around the corner, and the Insiders spend a few minutes forecasting what they expect to see at the show. They interview Tom Doyle of Aspinity on analog computing in AI.

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  • Fujitsu Releases 3-Channel, 24GHz Doppler Radar Sensor Module

    Fujitsu Releases 3-Channel, 24GHz Doppler Radar Sensor Module

    Fujitsu Components America introduced the FWM7RAZ01, a 3-channel, 24GHz Doppler radar sensor with a wide speed-detection range and high interference tolerance.

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  • Dev Kit Weekly: SiFive Learn Inventor Kit

    Dev Kit Weekly: SiFive Learn Inventor Kit

    The Learn Inventor kit is designed around one of the first commercially available RISC-V SoCs, the SiFive FE310-G003. That chip is built around SiFive’s E31 Core Complex.

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  • Everything You Need to Know about Obtaining Audio Certification

    Everything You Need to Know about Obtaining Audio Certification

    With rising demand, competition, and evolution of technology in the audio devices industry, the need for quality user experience for immersive and high quality sound output is increasing significant.

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  • 2020 Embedded Processor Report: Back to the Future with Analog Computing

    2020 Embedded Processor Report: Back to the Future with Analog Computing

    Analog computing – and even analog signal processing – appears to be making a comeback. Why?

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  • Dev Kit Weekly: Renesas EK-RA6M3G Graphics Evaluation Kit

    Dev Kit Weekly: Renesas EK-RA6M3G Graphics Evaluation Kit

    Dev Kit Weekly starts 2020 off with a BANG! and the Renesas EK-RA6M3G Graphics Evaluation Kit. The kit is headlined by a new RA MCU, 4.3" cap-touch LCD screen, tons of security, and a whole lot more.

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  • Google, Murata Integrate Coral Edge TPU in Tiny AI Module

    Google, Murata Integrate Coral Edge TPU in Tiny AI Module

    The custom-designed module measures a tiny 10 mm x 15 mm x 1.5 mm while delivering up to 4 TOPS of performance at the expense of only 2 TOPS per watt of power consumption.

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  • Vulkan 1.2 GPU Acceleration Spec Released by Khronos Group

    Vulkan 1.2 GPU Acceleration Spec Released by Khronos Group

    23 API extensions in new version of the core specification improve GPU functionality and performance.

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  • GreenWaves’ Ultra-Low Power GAP9 IoT Apps Processor Suits Intelligence at the Edge

    GreenWaves’ Ultra-Low Power GAP9 IoT Apps Processor Suits Intelligence at the Edge

    GAP9 lets OEMs embed machine learning and signal processing capabilities into battery-powered or energy-harvesting devices.

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  • Winmate Unveils 7" Rugged Arm-Based Tablet M700DQ8 with Qualcomm Snapdragon™ Processor

    Winmate Unveils 7" Rugged Arm-Based Tablet M700DQ8 with Qualcomm Snapdragon™ Processor

    Ideal for field data capture in nearly any industry and application.

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  • MYIR Introduces $29 ARM SoM Powered by ST STM32MP1

    MYIR Introduces $29 ARM SoM Powered by ST STM32MP1

    The MYC-YA157C CPU Module is a powerful and low-cost SoM for various embedded applications.

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  • STMicroelectronics Combines STM32 MCU and LoRa Transceiver on One SoC

    STMicroelectronics Combines STM32 MCU and LoRa Transceiver on One SoC

    STMicroelectronics introduced what it claims is the industry’s first LoRa system-on-chip (SoC). Previously, the LoRa device was a separate transceiver that connected to a microprocessor.

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  • Inside the Black Box

    Inside the Black Box

    Most software is obtained as a binary executable. The program may run and does what it does, but the user has no knowledge of its inner workings and has no opportunity to modify its functionality.

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  • TI’s Jacinto 7 Processors Enable Automotive ADAS and Gateway Applications

    TI’s Jacinto 7 Processors Enable Automotive ADAS and Gateway Applications

    Texas Instruments (TI) released a new series of microprocessors, the Jacinto 7 line. It was introduced at CES amid a series of demos.

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  • Analog and Digital Discovery Tools Address the Demands of Professional Engineers

    Analog and Digital Discovery Tools Address the Demands of Professional Engineers

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  • D3 Engineering Launches Automotive Vision Development Kit Based on TI TDA4VM SoC

    D3 Engineering Launches Automotive Vision Development Kit Based on TI TDA4VM SoC

    The production-intent kit was designed to automotive temperature ranges and includes an automotive-grade power design with reverse battery protection, helping accelerate the design of ADAS systems.

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  • COM-HPC: Limitless High-Speed Scalability

    COM-HPC: Limitless High-Speed Scalability

    Scheduled for the first half of 2020, there is still some time to go before the final PICMG ratification of the COM-HPC specification.

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  • NXP Debuts i.MX Applications Processor with Neural Processing Unit for Advanced Machine Learning

    NXP Debuts i.MX Applications Processor with Neural Processing Unit for Advanced Machine Learning

    The new i.MX 8M Plus heterogeneous application processor with dedicated neural network accelerator, independent real-time sub-system, dual camera ISP, high-performance DSP and GPU for edge application

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  • NXP Unlocks Vehicle Data with the S32G Automotive Network Processors

    NXP Unlocks Vehicle Data with the S32G Automotive Network Processors

    Processors enable modern service-oriented gateways for rapid Over-the-Air (OTA) deployment of new capabilities and advanced edge-to-cloud analytics.

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  • QuickLogic to Show How Edge AI is Powering Next Generation Consumer Devices at CES 2020

    QuickLogic to Show How Edge AI is Powering Next Generation Consumer Devices at CES 2020

    QuickLogic, a developer of ultra-low power multi-core voice-enabled SoCs, embedded FPGA IP, and Endpoint AI solutions will be showcasing how its products enable AI-based voice control.

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