USC Viterbi’s Information Sciences Institute (ISI) and the Intel Corporation’s custom foundry organization announced a collaboration to design, fabricate and package integrated circuits (ICs) through USC ISI’s MOSIS unit. The partnership will offer multi-project-wafer (MPW) runs for the microelectronics community, integrating MOSIS manufacturing services with Intel’s high-performance device fabrication technology.
“This is a significant event for the U.S. microelectronics community,” according to MOSIS co-director John Damoulakis. “For the first time, the U.S. Government, R&D laboratories, companies, and academia will have access to Intel’s advanced fabrication and packaging technologies economically through MOSIS.” MOSIS will offer multi-project-wafer runs for prototype integrated circuits, as well as dedicated runs for low-volume production.
ICF’s Vice President Kapil Wadhera added: “The collaboration between Intel and MOSIS ensures that U.S. innovators have at their disposal proper IC design and fabrication technologies to rapidly and cost effectively realize their inventions for the U.S. industrial base, and to compete with their counterparts across the globe.”