Intrinsyc Launches Qualcomm Snapdragon-based Hardware Development Kit

May 2, 2019 Brandon Lewis

VANCOUVER, BRITISH COLUMBIA. Intrinsyc Technologies Corporation has realease a mobile hardware development kit (HDK) based on the Qualcomm Snapdragon 855 Mobile Platform. The Snapdragon 855 Mobile HDK is an open-frame solution based on an Android 9 operating system that delivers CPU, GPU, and DSP compute for local artificial intelligence (AI) applications.

In addition to a Qualcomm Kyro 485 CPU, Hexagon 690 DSP with two Vector eXtensions and a Tensor accelerator, Adreno 640 GPU, and AI engine on the Snapdragon 855, the HDK incorporates the following:

  • Connectivity: Wi-Fi 802.11ac 2x2 with MU-MIMO, Bluetooth 5.0, and GNSS (GPS/GLONASS/COMPASS/GALILEO)
  • I/O: 1x USB 3.1 Type C, 2x USB 3.0 Type A, DisplayPort over USB 3.1 Type-C, 1x Micro SD Card, 2x MIPI 4-lane DSI + touch panel, 4x MIPI 4-lane CSI with support for 3D camera configuration, 1x HDMI out
  • Expansion Headers: Sensor I/O, Headset, Audio I/O

The Snapdragon 855 Mobile HDK can be ordered from https://shop.intrinsyc.com/collections/product-development-kits/products/snapdragon-855-hdk.

About the Author

Brandon Lewis

Brandon Lewis, Editor-in-Chief of Embedded Computing Design, is responsible for guiding the property's content strategy, editorial direction, and engineering community engagement, which includes IoT Design, Automotive Embedded Systems, the Power Page, Industrial AI & Machine Learning, and other publications. As an experienced technical journalist, editor, and reporter with an aptitude for identifying key technologies, products, and market trends in the embedded technology sector, he enjoys covering topics that range from development kits and tools to cyber security and technology business models. Brandon received a BA in English Literature from Arizona State University, where he graduated cum laude. He can be reached by email at brandon.lewis@opensysmedia.com.

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