EFCO, congatec Partner on COM Express, SMARC, Qseven Carrier Board Design and System Integration Services

May 16, 2019 Brandon Lewis

TAIPEI, TAIWAN. EFCO and congatec have partnered on an integration service in which EFCO will provide standard carrier boards and customized system-level solutions for congatec’s COM Express Type 6, COM Express Type 7, SMARC, and Qseven industrial computing modules. The carrier boards will provide application-specific connectivity via USB 3.0, multiple Ethernet/PoE ports, DisplayPort, miniPCIe, and so on.

In addition, EFCO will bundle the eKit software package with the new carrier boards. eKit is a suite of proprietary artificial intelligence algorithms that enable advanced system monitoring and analysis.

EFCO’s system-level customization solutions provide a combination of carrier boards, computing modules, thermal components, and application-specific peripherals for applications such as factory automation, computer vision, surveillance, and IoT edge computing.

For more information visit www.efcotec.com or www.congatec.com.

About the Author

Brandon Lewis

Brandon Lewis, Editor-in-Chief of Embedded Computing Design, is responsible for guiding the property's content strategy, editorial direction, and engineering community engagement, which includes IoT Design, Automotive Embedded Systems, the Power Page, Industrial AI & Machine Learning, and other publications. As an experienced technical journalist, editor, and reporter with an aptitude for identifying key technologies, products, and market trends in the embedded technology sector, he enjoys covering topics that range from development kits and tools to cyber security and technology business models. Brandon received a BA in English Literature from Arizona State University, where he graduated cum laude. He can be reached by email at brandon.lewis@opensysmedia.com.

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