BOPLA to Appear at embedded world 2019

January 11, 2019 Laura Dolan

BOPLA will be appearing at embedded world from February 26 - 28 in Nuremberg in hall 3, booth 3-155 exhibiting its integration of displays and touchscreens into industrial embedded applications.


BOPLA’s developed casting technology is used for their integration into standard or customer-specific electronic housing, achieving optical bonding with the functionality of the individually designed user interfaces, supporting the technology for the combination of touch and glass units. They also offer particle-free assembly of optical, electronic or precision mechanical components for specific requirements.

BOPLA also offers printing, laser marking and cable assembly in addition to quality testing. 

For more information, visit

Previous Article
Alliance Memory’s Lead Times for Automotive Temperature DRAM Portfolio Reduced

Alliance Memory has slashed lead times for its DRAM automotive temperature ratings, guaranteeing lead times...

Next Article
AlphaICs Releases alphaEdge for L2+ Driverless Cars and Autonomous Systems

AlphaICs has released alphaEdge, powered by AlphaICs' proprietary Real AI Processor (RAP) inference chip.