ACM Research Released Ultra SFP AP Tool for Advanced Packaging Solutions

March 18, 2020 Perry Cohen

ACM Research introduced its Ultra SFP ap tool for advanced packaging solutions. The tool was designed to address yield issues arising from through-silicon via (TSV) processes and fan-out wafer-level packaging (FOWLP).

The Ultra SFP ap leverages ACM’s stress-free polishing (SFP) technology. Additionally, the company’s technology couples with chemical mechanical planarization (CMP) and wet-etch chambers into a single system. 

ACM also announced it delivered the first Ultra SFP ap to a leading Chinese wafer-level packaging provider during the fourth quarter of 2019. The outsourced assembly and test customer, who was not named in the press release, currently has the tool on its research and development line. The first round of qualification data is expected mid-2020.

The Ultra SFP ap’s proprietary electrochemical reaction mechanism involves the simultaneous delivery of electrolytes and a power source to the wafer as it rotates on the chuck to electrically remove metal ions from the wafer surface.

For more information, visit http://www.acmrcsh.com/

About the Author

Perry Cohen

Perry Cohen, associate editor for Embedded Computing Design, is responsible for web content editing and creation in addition to podcast production. He also assists with the publication’s social media efforts which include strategic posting, follower engagement, and social media analysis. Before joining the ECD editorial team, Perry has been published on both local and national news platforms including KTAR.com (Phoenix), ArizonaSports.com (Phoenix), AZFamily.com, Cronkite News, and MLB/MiLB among others. Perry received a BA in Journalism from the Walter Cronkite School of Journalism and Mass Communications at Arizona State university. He can be reached by email at perry.cohen@opensysmedia.com. Follow Perry’s work and ECD content on his twitter account @pcohen21.

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