HYPER-AL – Compact Embedded Board with Apollo Lake SoC

November 12, 2018 ICP Deutschland GmbH
HYPER-AL – Compact Embedded Board with Apollo Lake SoC
HYPER-AL – Compact Embedded Board with Apollo Lake SoC

A sophisticated cooling concept can help to prevent unwanted heat accumulation during the development of compact embedded systems or HMI units for installation in the machine. ICP Deutschland offers developers a suitable solution with the compact PICO-ITX Embedded Board HYPER-AL, which features an extended temperature range of -20°C ~ +60°C, a low power dissipation of max. 6W TDP as well as a combined cooling and mounting plate. The latter allows easy mounting of the embedded board at the machine, whereby the waste heat is dissipated directly via the adjacent chassis. The heart of the 100x72mm "small" CPU board is a powerful Intel Celeron N3350 on-board SoC, for which up to 8GB DDR3L SO-DIMM memory is available. Two LAN GbE, one HDMI, one RS-232 and two USB 3.0 interfaces are available. Two USB 2.0 and one LVDS interface are also available internally. The two graphic interfaces support two independent displays, whereby the HDMI port offers a resolution of up to 4K UHD. The graphics performance is based on the integrated Intel HD Graphics Gen9 Low Power Engine, which supports HEVC 4, H.264, VP8 as well as SVC and MVC. Two M.2 ports (2230/2242) are available as space-saving expansion slots. Upon customer request, ICP can supply the HYPER-AL with appropriate RAM, SSDs and pre-installed with the requested operating system. An additional heat sink is available for classic mounting applications.

 

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