ASROCK INDUSTRIAL TO DISPLAY EXPERTISE AT COMPUTEX

May 20, 2019 Brandon Lewis

Taipei, Taiwan (May 16, 2019) ASRock Industrial Computer Corp. (ASRock Industrial), a world leader in Industrial PC motherboards, will be showing a wide range of cutting-edge products in booth L0410 at COMPUTEX TAIPEI, to be held May 28-June 1.

In addition, on May 30 from 2:00-6:00pm, ASRock Industrial will hold a seminar to present new products, a product roadmap and speeches by representatives of Intel and Amazon Web Services (AWS).
 
Showing off their expertise in industrial and embedded computing, ASRock Industrial will have products featuring the latest Intel and AMD chips, as well as athena, a sleek AI edge camera with innovative features targeting the retail industry. Here are some highlights -
  • Live Demos - athena A1 with AWS Greengrass & Jupiter H310 with Gorilla IVAR: The athena A1 is a is an AI edge camera which supports Intel's Movidus™ and OpenVINO™ tool kits for recognition analysis applications. Jupiter-H310 is a powerful embedded box computer that can support 16 cameras and six channels of video recognition at once. Both products' functions will be demonstrated live during the show.
  • iBOX-8365U, NUC-8365U, NUCBOX-8365U & IMB-1216: all based on Intel's latest eighth-generation processor Whiskey Lake-U i5-8265U. The iBOX-8365U is a fanless, compact, ruggedized system suitable for most industrial and embedded applications. Easily expandable and configurable, the iBOX-8365U boasts two DisplayPort connectors and one HDMI port that allow for three simultaneous displays. Also on board are three USB 3.0 and two USB 2.0 connectors, two RJ45 ports for 10/100/1000 Ethernet, one COM port and one 12V DC-in jack for the power adapter (included). The NUC-8365U is a board without the metal casing and comes with an active heatsink (fansink) for added thermal dissipation. There is one M.2 Key E (2230) to support PCIe and USB, and one M.2 Key M (2242/2260/2280) for SATA3 and PCIe. The IMB-1216 is a mini-ITX board-only system.
  • IMB-V1000, 4X4-R1000, 4X4 BOX-R1000, & IBOX-R1000: all using AMD's Ryzen™ Embedded SoC's. The IMB-V1000 is a motherboard that utilizes the powerful AMD Ryzen™ Embedded V1000 series, quad core, dual channel DDR4 and also ECC memory SO-DIMM up to 32GB, with power consumption from 12W-54W. It has four ports for DIsplyPort 1.4 and supports up to four simultaneous displays. The other three products use the R1000 series, with two cores, dual channel DDR4 along with ECC memory SO-DIMM up to 32GB. All three products feature two ports for DisplayPort 1.4 and one for HDMI 2.0 output that can display three separate screens at the same time or be configured to one large screen; one M.2 Key M 2242/2260/2280 with PCIe x4 and SATA3, and one M.2 Key E 2230 with PCIe and USB 2.0 for WiFi. There are three USB 3.1 ports, two RJ45 connectors for 10/100/1000 Ethernet and a reserved LPC header for TPM/Debug use. All products can run on Windows 10 and Linux kernel 4.18 and above.
 
"Our booth at this year's COMPUTEX show will be really packed with great products and excellent live demos," said James Lee, General Manager of ASRock Industrial. "Anyone interested in the latest embedded computing products or video recognition needs to stop by and check it out."
 
ABOUT ASROCK INDUSTRIAL
ASRock Industrial Computer was established as an independent company in July 2018, focusing on the fields of motherboards, edge computers and cameras, and other products for the manufacturing, business and retail industries. It is the world's leader in Industrial PC motherboards, with customers located around the globe. Previously, it had been a business unit of ASRock Inc. (est. 2002) which was set up in 2011.
 
By becoming an independent company ASRock Industrial can devote all its resources to B2B activities. Our products serve the Commerce, Automation, Robot, Entertainment and Security industries. With a core R&D design team of almost 65% of total staff, ASRock Industrial has the resources to develop reliable, leading-edge products for your business needs. All products can be bought off-the shelf or customized to the demands of OEMs/ODMs.

About the Author

Brandon Lewis

Brandon Lewis, Editor-in-Chief of Embedded Computing Design, is responsible for guiding the property's content strategy, editorial direction, and engineering community engagement, which includes IoT Design, Automotive Embedded Systems, the Power Page, Industrial AI & Machine Learning, and other publications. As an experienced technical journalist, editor, and reporter with an aptitude for identifying key technologies, products, and market trends in the embedded technology sector, he enjoys covering topics that range from development kits and tools to cyber security and technology business models. Brandon received a BA in English Literature from Arizona State University, where he graduated cum laude. He can be reached by email at brandon.lewis@opensysmedia.com.

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