Pixus Technologies, a provider of embedded computing and enclosure solutions, now offers the RiCase Premier line of modular electronics enclosures in 3U height at a 300mm depth and a 4U height at a 420mm depth. The new sizes expand the range of 10.5” and 19” wide instrumentation cases, offering more standard choices.
The Pixus RiCase series of instrumentation cases combine a rugged design and an attractive all-metal design. The corners are rounded for aesthetics, mechanical protection, and to prevent snags/injuries. They also have the option of securely stacking on top of another RiCase enclosure. There are 3 standard color codes, which can be used to signify the end-user’s product line. With a modular design, there are a vast range of size options from 1U-10U heights, 19” and 10.5” widths, and 300, 420, and 540mm depths. Customized sizes are also available upon request. There are also provisions for mounting slide-in equipment and modular assemblies at regular intervals per DIN and IEC 60 specifications.
With a rugged design, the RiCase enclosures have been approved by end-users in the energy exploration and other industries for weight load support and reliability. Vented and non-vented covers are available as well as multiple front and rear panel options. This includes hinged doors in metal or acrylic glass.
Pixus offers instrumentation cases in the RiCase and Vario Versatile formats. The company also provides open standard embedded computing chassis platforms, backplanes, and subrack components.
About Pixus Technologies
Leveraging over 20 years of innovative standard products, the Pixus team is comprised of industry experts in electronics packaging. Founded in 2009 by senior management from Kaparel Corporation, a Rittal company, Pixus Technologies' embedded backplanes and systems are focused primarily on ATCA, OpenVPX, MicroTCA, and custom designs. Pixus also has an extensive offering of VME-based and cPCI-based solutions. In May 2011, Pixus Technologies became the sole authorized North and South American supplier of the electronic packaging products previously offered by Kaparel Corporation and Rittal.