Dev Kit Weekly – Electric Imp C001 Cellular Breakout Kit

April 30, 2019 Brandon Lewis

Join Embedded Computing Design's Editor-in-Chief Brandon Lewis as he reviews the latest electronic development kits in less than five minutes. 
 
This episode, Brandon gives a high level overview of the C001 Cellular Breakout Kit from managed IoT solution provider Electric Imp. The certified C001 module on the carrier board supports LTE Category 1 and 3G HSPA operation over AT&T, T-Mobile, and Verizon networks, as well as concurrent cellular, 10/100 Ethernet, and Wi-Fi connections. The board is also outfitted with a Mikrobus socket and two Grove connectors, making it a great starting point for IoT engineers looking to prototype wide-area network designs. 
 
Of course, a Taoglas antenna is included so you can start communicating with Electric Imp's Managed Cloud out of the shoot, and test over-the-air (OTA) updates to the onboard Arm Cortex-M7.
 
The Imp C001 Cellular Breakout Kit retails for $129, while the module will set you back $85. But, as always, you can win it for free by entering the raffle below.

Questions for @techielew about the kit? Leave a comment. Or, take a deeper dive on the Imp C001 by visiting https://store.electricimp.com/collections/impcellular/products/impc001-breakout-board-kit-preorder?variant=7599263973399.

About the Author

Brandon Lewis

Brandon Lewis, Editor-in-Chief of Embedded Computing Design, is responsible for guiding the property's content strategy, editorial direction, and engineering community engagement, which includes IoT Design, Automotive Embedded Systems, the Power Page, Industrial AI & Machine Learning, and other publications. As an experienced technical journalist, editor, and reporter with an aptitude for identifying key technologies, products, and market trends in the embedded technology sector, he enjoys covering topics that range from development kits and tools to cyber security and technology business models. Brandon received a BA in English Literature from Arizona State University, where he graduated cum laude. He can be reached by email at brandon.lewis@opensysmedia.com.

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