Dev Kit Weekly: PowerFilm Solar Indoor/Outdoor e-peas Solar Development Kit

August 28, 2020 Brandon Lewis


We’ll make things better the second time around, and PowerFilm has certainly delivered on that with this week’s kit. A while back we reviewed the company’s Indoor Solar Development Kit, but now we’re onto the Indoor/Outdoor Solar Development Kit, the company’s first with “inside-out” capabilities.

This, of course, starts with the panels. There are two different panels here, the MPT2.4-21 panels of the PowerFilm Classic Application Series and the LL200-2.4-37 indoor panels, both of which are based on amorphous silicon material – the same stuff that powers the calculator you used to use before you got a smartphone. And you’ll note, that they are just a couple centimeters by a couple centimeters each.

This kit also features new energy harvesting circuitry from E-Peas. E-Peas’ AEM10941 chip is capable of extracting DC power from up to seven solar panels at a time and delivering it to a storage element like the kit’s 60 milliamp hour rechargeable LiPo batter. The AEM10941 features an ultra-low-power cold start of 3 µW at 380 mV to ensure as little energy is wasted as possible, and integrates multiple low dropout regulators. The ultra-low-power boost converter within comes with the maximum power point tracking – MPPT – ratio configured to 80 percent, and measures Voc every 5 seconds.

All in all, this is another awesome way to get started with a renewable way of powering IoT sensors, offering high performance at a reasonable cost. If you’re interested in one of your own, you can order it online from for just $59.

Or, as always, you can register for this week’s raffle, and perhaps you’ll win this one for free. And yes, we deliver.


Comment at will, and tune in next week for another edition of Dev Kit Weekly.

About the Author

Brandon Lewis

Brandon Lewis, Editor-in-Chief of Embedded Computing Design, is responsible for guiding the property's content strategy, editorial direction, and engineering community engagement, which includes IoT Design, Automotive Embedded Systems, the Power Page, Industrial AI & Machine Learning, and other publications. As an experienced technical journalist, editor, and reporter with an aptitude for identifying key technologies, products, and market trends in the embedded technology sector, he enjoys covering topics that range from development kits and tools to cyber security and technology business models. Brandon received a BA in English Literature from Arizona State University, where he graduated cum laude. He can be reached by email at

Follow on Twitter Follow on Linkedin Visit Website More Content by Brandon Lewis
Previous Article
Product of the Week: Microchip PolarFire SoC FPGA Icicle Kit
Product of the Week: Microchip PolarFire SoC FPGA Icicle Kit

The PolarFire SoC Icicle Kit is an eval platform for mid-range, RISC-V-based SoC FPGAs with secure hardware...

Next Article
RS Components Upgrades DesignSpark Mechanical 3D CAD Modeling Software
RS Components Upgrades DesignSpark Mechanical 3D CAD Modeling Software

DesignSpark Mechanical features built-in help text, quick-guide tutorials, example designs, and access to a...