Dev Kit Weekly Raffle: Enter to Win

April 10, 2019 Brandon Lewis

The Dev Kit Weekly with Embedded Computing Design Editor-in-Chief Brandon Lewis updates you on the latest electronics development kits – and gives you a chance to start engineering on them for free.

One kit will be reviewed each week and then raffled off to participants who fill out the form below. There is no cost to participate, we just need your contact information (NOTE: Kits will only be shipped to addresses in North America).

Raffle Period/Kit:

About the Author

Brandon Lewis

Brandon Lewis, Editor-in-Chief of Embedded Computing Design, is responsible for guiding the property's content strategy, editorial direction, and engineering community engagement, which includes IoT Design, Automotive Embedded Systems, the Power Page, Industrial AI & Machine Learning, and other publications. As an experienced technical journalist, editor, and reporter with an aptitude for identifying key technologies, products, and market trends in the embedded technology sector, he enjoys covering topics that range from development kits and tools to cyber security and technology business models. Brandon received a BA in English Literature from Arizona State University, where he graduated cum laude. He can be reached by email at brandon.lewis@opensysmedia.com.

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