Dev Kit Weekly – Maxim Integrated MAX86150EVSYS Mobile Health Monitoring Kit

September 6, 2019 Brandon Lewis

This week's kit is the Maxim Integrated MAX86150EVSYS, a mobile health monitoring evaluation platform. But rather than one piece of hardware, you actually get two: The MAX86150 electrocardiogram and photoplethysmogram bio-sensor module, and the MAX32630FTHR microcontroller board.

But don't be confused: in this dev kit, the MAX86150 PPG and 1-lead ECG sensor module is the star of the show. It of course features the MAX86150 sensor, a high signal-to-noise integrated heart rate monitor and pulse oximetry optical sensor. The sensor itself measures in at a tiny 3.3 mm x 5.6 mm x 1.3 mm and boasts an ultra-low shutdown current of 0.7 µA, making it an ideal starting point for medical wearable device prototypes.

Dry contact electrodes are also present on the module to help you get up and running with mobile healthcare designs quickly.

Still, this wouldn't really be a "mobile" health monitoring development kit without the companion MAX32630FTHR. This board gives the evaluation platform its intelligence, sporting an Arm Cortex-M4-based MCU, power management IC, and, of course, Bluetooth module, and 6-axis accelerometer/gyroscope.   

The kit even comes with Windows 10 GUI software, giving you really everything you need to quickly prototype a high-end wearable device.

All of that is available for $125 from authorized distributors. Or for free if you win the raffle below:

https://opensysmedia.formstack.com/forms/dev_kit_weekly_kit_raffle

If you're interested in learning more, visit the MAX86150EVSYS webpage at https://www.maximintegrated.com/en/products/sensors/MAX86150EVSYS.html.... Or, ask @techielew in the comments section.

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See you next week...

About the Author

Brandon Lewis

Brandon Lewis, Editor-in-Chief of Embedded Computing Design, is responsible for guiding the property's content strategy, editorial direction, and engineering community engagement, which includes IoT Design, Automotive Embedded Systems, the Power Page, Industrial AI & Machine Learning, and other publications. As an experienced technical journalist, editor, and reporter with an aptitude for identifying key technologies, products, and market trends in the embedded technology sector, he enjoys covering topics that range from development kits and tools to cyber security and technology business models. Brandon received a BA in English Literature from Arizona State University, where he graduated cum laude. He can be reached by email at brandon.lewis@opensysmedia.com.

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