congatec’s AI-Based Vision Platforms Will be at Japan’s IoT/M2M Expo

April 22, 2019 Alix Paultre

congatec will be exhibiting at Japan IoT/M2M Expo (booth 10-42 West Hall 2, 1F), showcasing its latest demo platforms for next-generation Artificial Intelligence (AI) based embedded vision systems. Designed in cooperation with partners including NXP Semiconductors, Intel, Basler, and Real-Time Systems, the platforms address various AI-based embedded vision applications.

The devices integrate AI and deep learning as well as camera technologies such as MIPI and real-time hypervisor technologies in order to consolidate real-time control and smart camera analytics on one single platform. The demo system designed in cooperation with Intel and Real-Time Systems targets the next generation of vision-based collaborative systems using situational awareness with deep learning-based AI algorithms. 

Based on a COM Express Type 6 module with Intel Xeon E2 processor, the system integrates three preconfigured virtual machines. One operates a Basler vision camera, with vision-based object recognition running on Linux via the Intel OpenVino software, with AI algorithms executed on an Intel Arria 10 FPGA card from Refexces. Another partition hosts a gateway for secure IoT connectivity. 

congatec will also show a face-recognition demo system for applications needing real-time connectivity to a central database of images to identify people. The demo is based on Basler's dart camera series with USB 3.0 and a conga-PA5 Pico-ITX board with 5th generation Intel Atom, Celeron or Pentium processors.

For more information, visit

Previous Article Challenges Developers to Reimagine Everyday Life with AI in New IoT Contest

Participants tasked with demonstrating the power of SmartEdge Agile and the Brainium portal to deploy intel...

Next Article
Bridgetek and Zerynth & Riverdi to Forge IoT Tech Partnership

Bridgetek announced a three-way collaborative partnership with Zerynth and Riverdi to develop next-generati...

How to Develop Cross-Industry IoT Interoperability

Multi-Part Series