VadaTech, a manufacturer of integrated systems and embedded boards, announced the release of AMC573. The AMC573 utilizes the Xilinx XCZU28DR RFSoC and is compliant to AMC.1, AMC.2, AMC.3 and AMC.4 specifications. It has an onboard, re-configurable FPGA which interfaces directly to the AMC FCLKA, TCLKA-D. The module has two banks of 64-bit wide DDR4 memory with ECC (16 GB in total). This allows for large buffer sizes to be stored during processing as well as for queuing the data to the host.
The XCZU28DR includes a quad-core ARM Cortex-A53 application processing unit and dual-core Cortex-R5 real-time processing as well as over 4,200 DSP, 930 K logic cells and over 60 Mb of internal memory (including 22.5 Mb of UltraRAM). The chip also includes a soft-decision FEC block supporting low-density parity check (LDPC) decode/encode and Turbo decode for use in 5G wireless, backhaul, DOCSIS, and LTE applications. The Module has onboard 64 GB of Flash, 128 MB of boot flash and an SD Card as an option.
The front panel incorporates 18 high-density RF Coaxial connectors routed to the 8 ADC (12-bit @ 4 GSPS) and 8 DAC (14-bit @ 6.4 GSPS) in the RFSoC. Also included are Trig-in, Trig-out, clock inputs, dual USB, dual serial ports via MicroUSB a DisplayPort interface and a high-density connector for external I/O. The default I/O is 8 LVDS or single ended +1.8V I/O but can be modified to meet customer requirements.
For more information, visit www. vadatech.com.
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