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  • How the SMARC™ Module 2.1 revision responds to the latest IoT- and AI-driven demands on embedded computing solutions

    How the SMARC™ Module 2.1 revision responds to the latest IoT- and AI-driven demands on embedded computing solutions

    Learn more about the new SMARC™ 2.1 specification, new key features and changes. Get a detailed comparison between the SMARC™ 2.0 module and the SMARC™ 2.1 module and find out more about special use..

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  • Texas Instruments’ CC2652RB MCU is optimized for wireless communication and advanced sensing.

    Design with Ease
  • Smart DV Releases Verification IP Suite for Arm AMBA Protocol

    Assertion IP and SimXL synthesizable transactors for SoC and system-level testing are also part of the release.

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  • Maxim Integrated Releases Industry’s Thinnest Dual-Photodetector Optical Sensor Solution

    Maxim Integrated Releases Industry’s Thinnest Dual-Photodetector Optical Sensor Solution

    Maxim Integrated released the MAXM86146 dual-photodetector optical sensor solution.

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  • Dev Kit Weekly: Lattice Semiconductor MachX03D Development Board

    Dev Kit Weekly: Lattice Semiconductor MachX03D Development Board

    In this week’s Dev Kit Weekly, Perry is going on lock-down the MachX03D Development Board from Lattice Semiconductor.

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  • Win One of SEVEN Renesas RA Series Evaluation Kits

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  • Premio Unveils Intel 9th Gen Industrial Motherboard For Advanced Embedded And IoT Solutions

    Premio Unveils Intel 9th Gen Industrial Motherboard For Advanced Embedded And IoT Solutions

    Premio released its CT-MCL01 MicroATX industrial motherboard for rugged IoT processing.

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  • Solving the Challenges of eMobility with Quectel’s Dual-Band, Multi-Constellation GNSS Modules

    Solving the Challenges of eMobility with Quectel’s Dual-Band, Multi-Constellation GNSS Modules

    GNSS has been widely adopted as a method to track and trace large items such as ships, trucks, heavy equipment, cars and high-value freight.

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  • Defining Digital Twins

    Defining Digital Twins

    In this edition of the Embedded Insiders, Brandon and Rich are joined by Brady Benware, VP and general manager of the tessent portfolio at Mentor, a Siemens business.

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  • Time Sensitive Networking: Five Ways the IEEE Standards Will Advance Industry 4.0

    Time Sensitive Networking: Five Ways the IEEE Standards Will Advance Industry 4.0

    This new paradigm of ubiquitous connectivity is inspiring manufacturers, from the largest automation OEMs to emerging businesses.

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  • Winmate Unveils 32-inch PT Series Custom Touchscreen Display Solutions

    Winmate Unveils 32-inch PT Series Custom Touchscreen Display Solutions

    Brilliant custom 32-inch display with PCAP multi-touch screen for the next generation of enterprise-grade display solutions.

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  • Neousys Technology Rugged Embedded GPU AI Computer is Once Again Designated to Man the Latest Baidu Apollo Autonomous Driving Platform

    Neousys Technology Rugged Embedded GPU AI Computer is Once Again Designated to Man the Latest Baidu Apollo Autonomous Driving Platform

    Neousys Technology's Nuvo-8108GC is an industrial-grade in-vehicle GPU-aided AI platform that supports a 250W NVIDIA® GPU and Intel® Xeon® E or 9th/ 8th-Gen Core™ processors.

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  • Imagination Announces XS, an Advanced GPU IP for the Automotive Industry

    Imagination Announces XS, an Advanced GPU IP for the Automotive Industry

    Delivering safety-critical graphics, ADAS compute acceleration, and ISO 26262 conformance

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  • Winmate Collaborates with Microsoft to Accelerate IoT Deployment

    Winmate announces that it has joined Microsoft Azure Certified for Internet of Things (IoT), allowing customers to have IoT solutions up and running quickly.

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  • VersaLogic Releases Error-Correcting Credit Card Sized Computers

    VersaLogic Releases Error-Correcting Credit Card Sized Computers

    Named "Harrier", the new embedded computer features Intel's latest 5th generation Apollo Lake Atom processors with error-correcting memory

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  • Denchi Applies its Expertise to Powering Stairlifts

    Denchi Applies its Expertise to Powering Stairlifts

    Denchi Group has secured a large-scale contract with DC motor system manufacturer Lemac.

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  • Enki (brand of ADEO Group) scales up Smart Home ecosystem integration thanks to MicroEJ solutions

    Enki (brand of ADEO Group) scales up Smart Home ecosystem integration thanks to MicroEJ solutions

    MicroEJ, the leader in trusted virtual execution environments for cost effective SoC/MCU/MPU, today announces its partnership with Leroy Merlin.

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  • Driving Network Convergence for 5G

    Driving Network Convergence for 5G

    Over the past several years, 5G has transformed from a concept spoken about at conferences to a reality with numerous deployments being rolled out across the globe.

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  • High-Performance Multimedia Single Board Computer with NXP i.MX 8M CPU from F&S Elektronik

    High-Performance Multimedia Single Board Computer with NXP i.MX 8M CPU from F&S Elektronik

    The i.MX 8M CPU from NXP is suitable for applications with graphics in building automation, HMI in industry and medical technology, as well as POS and POI terminals.

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  • How Six Companies Are Using AI to Accelerate Automotive Technology

    How Six Companies Are Using AI to Accelerate Automotive Technology

    AI is not only used for path planning and obstacle avoidance, but incorporated in every step of development from modeling how systems will perform on the road to gathering parts for manufacturing.

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  • Orchestrating 5G’s Next Wave

    Orchestrating 5G’s Next Wave

    The newest iteration of the widely deployed MIPI RF Front End Control Interface, MIPI RFFE v3.0, delivers the fundamental orchestration within and across wireless devices.

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  • AccelerComm Release Chanel Coding Software with Zynq UltraScale+™ RFSoC devices

    AccelerComm Release Chanel Coding Software with Zynq UltraScale+™ RFSoC devices

    AccelerComm announced the release of its Channel Coding software with the Zynq UltraScale+™ RFSoC devices from Xilinx.

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