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About the Author
Brandon Lewis, Editor-in-Chief of Embedded Computing Design, is responsible for guiding the property's content strategy, editorial direction, and engineering community engagement, which includes IoT Design, Automotive Embedded Systems, the Power Page, Industrial AI & Machine Learning, and other publications. As an experienced technical journalist, editor, and reporter with an aptitude for identifying key technologies, products, and market trends in the embedded technology sector, he enjoys covering topics that range from development kits and tools to cyber security and technology business models. Brandon received a BA in English Literature from Arizona State University, where he graduated cum laude. He can be reached by email at firstname.lastname@example.org.Follow on Twitter Follow on Linkedin Visit Website More Content by Brandon Lewis
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A sensor device that triggers a certain function when an object is either present or not may sound simple. But in reality, there are numerous factors to consider in order to avoid false positive...
Trying to decide between Off the Shelf and custom hardware? Don't forget to consider these important factors!
Vishay released the Siliconix SiZ240DT, a 40 V n-channel MOSFET half bridge power stage.
InferX X1 offers ideal performance of neural network models such as object detection and recognition, and other neural network models, for robotics, industrial automation, medical imaging, and more.
Leading vendor of advanced USB connectivity ICs/modules FTDI Chip has made Digi-Key Electronics the recipient of its 2020 global distribution award.
Yamaichi has further developed and optimised the Volkswagen standard interface. The mass production has already started.
D3 Engineering announced their DesignCore RS-6843AOP and RS-6843AOPU mmWave Radar Sensors.
Powered by Intel Core i5-7200U processors and Microsoft’s Windows 10 IoT Enterprise operating system, M133K Rugged Tablet PCs can serve as a real-time, cloud connected control point.
The new facility is enabling the company to scale up production of its (Hi-Rel) connectors to meet market requirements.
Companies looking to deliver value in the AIoT marketplace will be faced with extreme design requirements. To succeed, AIoT vendors must carefully consider their entire system design.
It is essential to ensure that all the blocks have a comparable number of erasures so that the life and reliability of the SSD are maximized.
Last year's 4 GB platform costs $99. Now, after some tweaks, the 2 GB version is just $59. And although it's in the price range of a Raspberry Pi, it offers the next level of oomph for AI newbies.
By integrating the wireless charging solution into its systems Stäubli WFT is reacting to the increasing customer demand for intelligent charging concepts.
Per the company, the MAX25430 decreased design size up to 40 percent and eliminates microcontrollers, metal enclosures, and heat sinks for 25 percent lower cost than competitive solutions.
VadaTech announced the release of the FMC238 and FMC239, which are a FPGA Mezzanine Cards per VITA 57.1 standard.
Power supplies produce it, and it must be addressed, but what are the sources and what are typical mitigation strategies?
Septentrio announced it has expanded its GPS/GNSS OEM portfolio with the AsteRx-m3 Pro receiver board.
Powered by the 11th Gen Intel® Core™ processors and based on the new COM-HPC standard with FuSa extensions, the CPU-18-02 enables Functional Safety applications at the Edge
From intense vibrations, mechanical shocks, wide temperature swings and so much more, designing for harsh environments requires extensive experience. But what could go wrong if you miss one of these..
It’s no secret that electronics systems are becoming more complex across all industries. It is less obvious how this complexity has infiltrated power supply design.