Synchronized HexCamera development kit unleashes power of NVIDIA Jetson TX2/TX1

September 4, 2017 Brandon Lewis

e-con Systems Inc. has introduced the e-CAM30_HEXCUTX2, an advanced camera solution that leverages the NVIDIA Jetson TX1/TX2 development kit. The e-CAM30_HEXCUTX2 consists of six 3.4 megapixel HD cameras that can be synchronized for high-resolution 360º surveillance and imaging.

Each e-CAM30_HEXCUTX2 camera is based on the low-light e-CAM30_CUMI0330_MOD camera module, a 0.3” AR0330 color CMOS image sensor from ON Semiconductor, and an integrated high-performance image signal processor (ISP). The cameras leverage 2-lane MIPI CSI-2 interfaces to bring signals out to the e-CAMHEX_TX2ADAP adaptor board, which connects to the NVIDIA Jetson TX1/2 carrier board via the J22 connector.

The solution can additionally stream YUV422 formatted video in VGA, 720p, 1080p or 3 megapixel resolutions at 30 frames per second (fps) in synchronous or asynchronous mode.

Interchangeable M12 lenses are also included.

“The customized micro-coaxial cable interface of the e-CAM_CUMI0330_MOD camera is 30 cm long and offers greater flexibility in mechanical arrangement of cameras and better mechanical reliability thanks to its locking connector” said Mr. Ashok Babu, President, e-con Systems Inc. “Customers can build the TX1/TX2 carrier boards based on their requirements and use our cameras to build their final target application, such as 360 degree video surveillance, large-area imaging, or even 720 degree video capture by placing 6 cameras in the shape of cube.”

e-con Systems has also developed a camera driver based on the V4L2 Linux API for versions 2.3/3.0 of the NVIDIA Jetpack. Any V4L2 compatible application can therefore interface with the e-CAM30_HEXCUTX2 cameras.

A gstreamer-based sample application is also available that demonstrates video previews from all six cameras.

I2C interfaces come standard for camera control.

The e-CAM30_HEXCUTX2 is available now. For more information, visit


About the Author

Brandon Lewis

Brandon Lewis, Editor-in-Chief of Embedded Computing Design, is responsible for guiding the property's content strategy, editorial direction, and engineering community engagement, which includes IoT Design, Automotive Embedded Systems, the Power Page, Industrial AI & Machine Learning, and other publications. As an experienced technical journalist, editor, and reporter with an aptitude for identifying key technologies, products, and market trends in the embedded technology sector, he enjoys covering topics that range from development kits and tools to cyber security and technology business models. Brandon received a BA in English Literature from Arizona State University, where he graduated cum laude. He can be reached by email at

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