Dev Tools and OS

  • Embedded Toolbox: Create an IoT-Enabled Weather Panel in 15 Minutes with Renesas RA MCUs, SEGGER AppWizard & Amazon FreeRTOS

    Embedded Toolbox: Create an IoT-Enabled Weather Panel in 15 Minutes with Renesas RA MCUs, SEGGER AppWizard & Amazon FreeRTOS

    Join Brad Rex, Senior Manager in the MCU Business Unit at Renesas Electronics on this episode of Embedded Toolbox as he builds an IoT-enabled Weather Panel in just 15 minutes using an Renesas RA MCU.

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  • How to do Machine Learning on Arm Cortex-M Microcontrollers

    How to do Machine Learning on Arm Cortex-M Microcontrollers

    Learn how to do machine learning on Cortex-M Microcontrollers. This guide offers methods for NN architecture exploration using image classification on a sample CIFAR-10 dataset to develop models...

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  • Optimize Power Distribution Networks for Flat Impedance

    Optimize Power Distribution Networks for Flat Impedance

    Optimize your power distribution network to achieve a target impedance, while avoiding high Q resonances that can cause rogue waves.

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  • Toradex Launches New SoM Family, Verdin

    Toradex Launches New SoM Family, Verdin

    Toradex announced the launch of its newest family of System on Modules (SoM), Verdin. The first modules of the line feature the NXP i.MX 8M Mini/Nano applications processors.

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  • MixComm Developing 5G, SUMMIT 2629TM Front End IC on GLOBALFOUNDRIES’ 45RFSOI Solution

    MixComm Developing 5G, SUMMIT 2629TM Front End IC on GLOBALFOUNDRIES’ 45RFSOI Solution

    MixComm announced its first production device, the SUMMIT 2629. The start-up’s technology is based upon breakthroughs developed at Columbia University CoSMIC lab led by Dr. Harish Krishnaswamy.

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  • SECO Releases New COM EXP T7 Development Kit

    SECO Releases New COM EXP T7 Development Kit

    Seco has released the COM Express T7 DEV KIT, a Cross Platform Development Kit compatible with both x86 and Arm COM Express Type 7 modules.

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  • Selecting an Approach to Build Flexible, Cost-Effective ECU Production Test Systems

    Selecting an Approach to Build Flexible, Cost-Effective ECU Production Test Systems

    Get the background & strategies you need: This white paper discusses the five main tester design challenges and five common approaches to ECU production test.

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  • HEITEC Releases HeiSys, embedded system platform

    HEITEC Releases HeiSys, embedded system platform

    HEITEC presented HeiSys, an embedded system platform, at the embedded world trade conference in Nuremberg, Germany, in February.

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  • Didn't Make it to embedded world 2020? No problem!

    NXP is excited to bring you the NXP eXperience – an online and interactive destination for all our news, content and training as it was originally planned for the show.

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  • MYIR Introduces the MYC-C335X-GW CPU Module

    MYIR Introduces the MYC-C335X-GW CPU Module

    MYIR introduced the MYC-C335X-GW CPU Module, a Linux-ready module powered by TI's AM335x ARM Cortex-A8 processor, featuring PowerVR SGX530 for 2D and 3D graphics acceleration.

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  • SQream Combats Large Data with Release of SQream DB v2020.1

    SQream Combats Large Data with Release of SQream DB v2020.1

    SQream DB enables the analysis of more data and dimensions, at query times possible for massive data volumes.

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  • Percepio Launches DevAlert Cloud Service for Remote Monitoring and Diagnostics of Deployed IoT Devices

    Percepio Launches DevAlert Cloud Service for Remote Monitoring and Diagnostics of Deployed IoT Devices

    DevAlert is a cloud service for IoT product organizations that provides awareness of firmware problems in deployed devices and visual diagnostic information to speed resolution.

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  • VersaLogic Expands its Arm-based Embedded Computer Line

    VersaLogic Expands its Arm-based Embedded Computer Line

    VersaLogic added a new model to its Swordtail product family, the latest in their line of production-ready Arm-based embedded computers.

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  • Fraunhofer IIS Brings MPEG Audio Codec Suite to NXP Semiconductors

    Fraunhofer IIS Brings MPEG Audio Codec Suite to NXP Semiconductors

    Fraunhofer Institute for Integrated Circuits (IIS) announced that NXP Semiconductors will support Fraunhofer’s MPEG Audio Software Development Kit (SDK).

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  • Take the Plunge into PCB Design

    Take the Plunge into PCB Design

    While I’ve been experimenting with circuits for years, decades even, my projects tend to be filled with a rat’s nest of wires. These snake about with the constant possibility of disconnection or other

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  • Proof-of-Concept and Prototyping Embedded Systems Made Easy

    Proof-of-Concept and Prototyping Embedded Systems Made Easy

    Though some industries have experienced the perpetual addition of embedded system complexities year after year, it is unlikely that any industry will escape it in years to come.

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  • Don’t Let Software Development Slow Down Your Embedded Solution

    Don’t Let Software Development Slow Down Your Embedded Solution

    When it comes to IIoT and embedded systems, rapid software development is crucial, for a variety of reasons. The most obvious is that design windows are fixed.

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  • How to secure network equipment using Infineon OPTIGA™ TPM hardware-based security solutions, the TPM Software Stack and Lanner security exp

    How to secure network equipment using Infineon OPTIGA™ TPM hardware-based security solutions, the TPM Software Stack and Lanner security exp

    Computers, servers and the people that operate them used to be the primary target of attackers. Today, because of increasing connectivity and dependence on networks, network equipment has become...

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  • Getting Certified

    Getting Certified

    There is an increasing focus on safety and security in a variety of embedded applications. This, in turn, drives a demand for certification of such systems.

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  • New Standards, New Uncertainties, New Education Demands

    New Standards, New Uncertainties, New Education Demands

    What the embedded computing industry is preparing for is the next generation of standards for modular system designs. COM-HPC will be THE focus of nearly all embedded computing vendors.

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