Automotive

  • dSPACE Introduces MicroAutoBox, Compact In-Vehicle Prototyping System

    dSPACE Introduces MicroAutoBox, Compact In-Vehicle Prototyping System

    The MicroAutoBox III by dSPACE provides updates from the previous MicroAutoBox II with improved connectivity, configuration and implementation software and, is equipped with a quad-core ARM processor.

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  • Design Featured at the Qt World Summit in Berlin

    Design Featured at the Qt World Summit in Berlin

    This year’s event, which was held at the Berlin Congress Center Nov. 4-6, featured industry keynotes from Google, Trend Micro, and web psychologist Nathalie Nahai, among others.

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  • AIWAYS and Shanxi Gaoping to Accelerate Commercialization of Methanol Fuel-Cell Vehicles

    AIWAYS and Shanxi Gaoping to Accelerate Commercialization of Methanol Fuel-Cell Vehicles

    AIWAYS signed a Project Cooperation Agreement with the People’s Government of Gaoping City in Shanxi, China to build a methanol fuel cell production facility in the city.

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  • Real-Time Innovations Unveils Connext Drive: Automotive-Grade Connectivity Solution for Autonomous Vehicle Development

    Real-Time Innovations Unveils Connext Drive: Automotive-Grade Connectivity Solution for Autonomous Vehicle Development

    Real-Time Innovations (RTI), a connectivity company, unveiled Connext Drive, which provides automotive manufacturers with the software and tools to build autonomous vehicles and fleets.

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  • Volkswagen Joins SEMI; Membership to Advance Automotive Electronics

    SEMI announced today that leading German vehicle manufacturer Volkswagen AG has joined SEMI.

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  • DataProphet Artificial Intelligence Helps Enable Nexteer Automotive to Drive Advanced Data Decisions

    Machine Learning Solution Implementation Aims to Reduce Scrap and Improve Quality in Mature Data Environment.

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  • KIOXIA America Introduces 512GB Automotive UFS

    KIOXIA America Introduces 512GB Automotive UFS

    The 512GB device joins the company’s existing lineup of Automotive UFS, which includes capacities of 16GB, 32GB, 64GB, 128GB, and 256GB.

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  • NXP Announces Automotive Ultra-Wideband Chip That Turns Smartphones into Car Keys

    NXP Announces Automotive Ultra-Wideband Chip That Turns Smartphones into Car Keys

    NXP, BMW Group, and Continental work on new auto Ultra-Wideband (UWB) use cases and standards in CCC

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  • ETAS and BlackBerry QNX Announce Cooperation for Software Platform Based on AUTOSAR Adaptive

    ETAS GmbH and BlackBerry Limited announced that the companies will cooperate to jointly develop and market a safety-critical platform for use in next generation connected and autonomous vehicles.

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  • How to Develop High-Performance Deep Neural Network Object Detection/Recognition Applications for FPGA-based Edge Devices

    This article explains how DNNs work and why FPGAs are becoming popular for inference tasks. It proceeds to showcase how DNN workloads can be executed on a development platform using a real world demo.

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  • How AI & ML Are Being Used to Relieve Traffic Congestion

    Bostonians spent an average of 164 hours sitting in their vehicles going nowhere slowly in 2018, losing $2,291 in personal value for the privilege. In response, planners are now leveraging AI and ML.

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  • Hyundai Autron Selects BlackBerry QNX to Power ADAS, Autonomous Driving Software Platform

    BlackBerry Limited announced Hyundai Autron selected BlackBerry QNX to power its advanced driver-assistance systems (ADAS) and autonomous driving software platform.

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  • Optima Design Automation Announces the "Optima Safety Platform" To Drive Order-of-Magnitude Safety Fault Analysis Performance Improvements

    Fault Injection Engine Forms the Basis of Unique Hard and Soft Error Automated Fault Analysis Solutions Accelerating ISO 26262 Verification and Increasing Device Quality.

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  • Optima Design Automation Launches with Focus on Next-Generation Semiconductor Functional Safety Tools

    Revolutionary, High-Performance Optima Safety Platform Propels Range of High-Coverage Safety Solutions for Automotive ISO 26262 Fault Analysis.

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  • Embedded Executive: Dr. Phil Lessner, Senior VP and CTO, KEMET

    Embedded Executive: Dr. Phil Lessner, Senior VP and CTO, KEMET

    The power that’s required to charge electric vehicles is quite high. And when you add wireless charging, the issues grow significantly.

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  • Volkswagen and NXP Deliver Safety to European Roads with World's Largest Rollout of Communicating Car Technology

    Volkswagen and NXP Deliver Safety to European Roads with World's Largest Rollout of Communicating Car Technology.

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  • Renesas Expands Access to Portfolio of Leading-Edge IP Licenses

    Additional IP Solutions Include Latest Cutting-Edge 7nm Process TCAM and Most Advanced Standard Ethernet TSN IPs.

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  • ESD Alliance Takes SMART Design to SEMICON Europa

    Program Features Presentations, Panel Discussion on Designing Electronic Systems for Future Applications to Showcase Advances in Electronic System Design.

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  • Newark Brings its Broadest Range of Molex Products to Customers

    Increased 'in stock' products across connectors, terminals, antennas and cable assemblies.

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  • STMicro and Audi to Develop Next-Generation Automotive Exterior Lighting

    STMicro and Audi to Develop Next-Generation Automotive Exterior Lighting

    STMicroelectronics announced its collaborative efforts with Audi to create the next generation of automotive exterior OLED lighting.

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