Brandon Lewis

Brandon Lewis, Editor-in-Chief of Embedded Computing Design, is responsible for guiding the property's content strategy, editorial direction, and engineering community engagement, which includes IoT Design, Automotive Embedded Systems, the Power Page, Industrial AI & Machine Learning, and other publications. As an experienced technical journalist, editor, and reporter with an aptitude for identifying key technologies, products, and market trends in the embedded technology sector, he enjoys covering topics that range from development kits and tools to cyber security and technology business models. Brandon received a BA in English Literature from Arizona State University, where he graduated cum laude. He can be reached by email at brandon.lewis@opensysmedia.com.

  • Google, Murata Integrate Coral Edge TPU in Tiny AI Module

    Google, Murata Integrate Coral Edge TPU in Tiny AI Module

    The custom-designed module measures a tiny 10 mm x 15 mm x 1.5 mm while delivering up to 4 TOPS of performance at the expense of only 2 TOPS per watt of power consumption.

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  • Vulkan 1.2 GPU Acceleration Spec Released by Khronos Group

    Vulkan 1.2 GPU Acceleration Spec Released by Khronos Group

    23 API extensions in new version of the core specification improve GPU functionality and performance.

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  • Recapping the 2020 Consumer Electronics Show

    Recapping the 2020 Consumer Electronics Show

    In this episode of Embedded Insiders, Brandon and Rich review some of the highlights from the 2020 Consumer Electroncis Show (CES).

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  • Vitrek DL Series Electronic DC Load Instruments Generate Wide-Range kW, mW or µW Loads

    Vitrek DL Series Electronic DC Load Instruments Generate Wide-Range kW, mW or µW Loads

    DL Series the platforms can support any combination of single or arbitrary loading sequences of up to 100 steps using constant voltage (CV), constant resistance (CR), constant current (CC), constant p

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  • Cadence PCB and SOLIDWORKS CAD Environments Connected by EMA’s CADSync

    Cadence PCB and SOLIDWORKS CAD Environments Connected by EMA’s CADSync

    With native bi-directional traceability and in-tool access to native CAD data structures, engineering teams can easily share high-fidelity design changes and other information that help reduce develo

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  • Wind River Acquires Star Lab, Bolsters Linux and Embedded System Cybersecurity Offerings

    Star Lab's solutions conform to NIST 800-53 technical controls for federal information systems

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  • MoDeCH Offers Downloadable SPICE Models for Analog, High-Speed Digital and Power Circuit Designers

    Model On! Search contains a library of more than 72,000 free and fee-based SPICE models for transistors, passive components, and ICs.

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  • Atmosic, Tonly Develop Ultra-Energy-Efficient BLE Module for Battery-Powered Devices

    Atmosic’s On-Demand Wake Up and Lowest Power Radio technologies help batteries last entire life of systems.

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  • CML Microcircuits Adds Advanced Voice Codec to Raspberry Pi

    CML Microcircuits Adds Advanced Voice Codec to Raspberry Pi

    Designed for digital voice and sensor applications, the single-chip CMX655D codec covers the entire signal chain.

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  • D3 Engineering Launches Automotive Vision Development Kit Based on TI TDA4VM SoC

    D3 Engineering Launches Automotive Vision Development Kit Based on TI TDA4VM SoC

    The production-intent kit was designed to automotive temperature ranges and includes an automotive-grade power design with reverse battery protection, helping accelerate the design of ADAS systems.

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  • Dev Kit Weekly: Texas Instruments TI-RSLK MAX Robotics Learning Kit

    Dev Kit Weekly: Texas Instruments TI-RSLK MAX Robotics Learning Kit

    The RSLK MAX is TI’s second generation robotics system learning kit, only this one is based on a completely solderless design that allows it to be assembled and repaired easily.

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  • Embedded Insiders Open Up on RISC-V Summit, MIPI Debug & Trace Specs

    Embedded Insiders Open Up on RISC-V Summit, MIPI Debug & Trace Specs

    The Insiders attended the second annual RISC-V Summit in San Jose earlier this month, and brought back some significant opinions about the show, the technology, and the direction of the Foundation.

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  • Dev Kit Weekly: Silicon Labs Bluetooth (5) Xpress BGX13P Starter Kit

    Dev Kit Weekly: Silicon Labs Bluetooth (5) Xpress BGX13P Starter Kit

    The Bluetooth Xpress BGX13P Evaluation Kit from Silicon Labs is – you guessed it – based on the BGX13P Bluetooth module.

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  • True AI Edge Compute Arrives in Highly Integrated Processors, IP

    As AI technology and deployments have progressed, several new engineering challenges have presented themselves.

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  • MLPerf: The New Industry Benchmark for AI Inferencing at the Edge

    MLPerf: The New Industry Benchmark for AI Inferencing at the Edge

    TOPS. FLOPS. GFLOPS. AI processor vendors calculate the maximum inferencing performance of their architectures in a variety of ways. Do these numbers even matter?

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  • Litmus Automation Integrates Off-the-Shelf Analytics Functions in LoopEdge IoT Edge Computing Platform

    Ready Analytics is a purpose-built analytics dashboard that reduces setup and configuration time for a variety of industrial analytics functions.

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  • Bridgetek Begins Production of PanL Smart Living Integrated Home Automation Solution

    Bridgetek Begins Production of PanL Smart Living Integrated Home Automation Solution

    The platform integrates a range of communications technologies such as Hue to consolidate the control of lighting, HVAC, appliance, and other smart building applications into a single system.

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  • STMicro, maxon Launch 100 W BLDC Motor Control Development Kit

    STMicro, maxon Launch 100 W BLDC Motor Control Development Kit

    The motor is designed for high output torque with low cogging torque, ensuring high precision and even motion across a range of speeds.

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  • NVIDIA to Launch Jetson Xavier NX Edge AI Supercomputer

    NVIDIA to Launch Jetson Xavier NX Edge AI Supercomputer

    The credit card-sized Xavier NX is capable of running multiple neural networks in parallel and processing data from multiple high-resolution sensors.

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  • Wind River Simics Adds Continuous Integration and Delivery Features

    The new version incorporates a third-generation thread scheduler, better integration and execution of SystemC components, and improved memory allocation to perform simulations 20 percent faster.

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