Brandon Lewis

Brandon Lewis, Editor-in-Chief of Embedded Computing Design, is responsible for guiding the property's content strategy, editorial direction, and engineering community engagement, which includes IoT Design, Automotive Embedded Systems, the Power Page, Industrial AI & Machine Learning, and other publications. As an experienced technical journalist, editor, and reporter with an aptitude for identifying key technologies, products, and market trends in the embedded technology sector, he enjoys covering topics that range from development kits and tools to cyber security and technology business models. Brandon received a BA in English Literature from Arizona State University, where he graduated cum laude. He can be reached by email at brandon.lewis@opensysmedia.com.

  • 42Crunch Introduces Small-Footprint, Low-Latency Micro API Firewall for Kubernetes Containers

    42Crunch security deploys a 20 MB micro API firewall to protect microservices from attacks or vulnerabilities.

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  • Striim’s Real-Time Streaming Data Integration Now Available for Microsoft Azure Service

    Striim is an end-to-end platform that offers real-time, non-intrusive change data capture from a variety of sources into the cloud.

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  • Workload Consolidation: The Entire IoT in One Box

    Workload Consolidation: The Entire IoT in One Box

    congatec has developed a proof of concept based on a six-core Core i7-based COM Express module, a type 1 hypervisor from Real-Time Systems, and Ubuntu Linux.

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  • A Trade War, the Tech Market, and a Taiwanese Trade Show

    Advantech CEO K.C. Liu comments on how the U.S.-China Trade War is affecting the technology market, while Computex Taipei vendors shift manufacturing back to the island nation.

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  • Windows 10 Cyber Hygiene Guide Published by Center for Internet Security

    The Guide offers free, real-world security tips for implementing baseline security protections on computers running Windows 10.

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  • How to Make the Last Foot of IoT Networks Plug n' Play

    How to Make the Last Foot of IoT Networks Plug n' Play

    PICMG CTO Doug Sandy explains how the standards organization's newest family of IoT specifications will help bring intelligence and interoperability to sensor nodes at the last foot of the network.

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  • QuickLogic, SensiML Deliver Edge AI Without A Data Scientist

    QuickLogic, SensiML Deliver Edge AI Without A Data Scientist

    At Sensors Expo 2019, embedded processor vendor QuickLogic and their subsidiary SensiML were on a mission to demystify artificial intelligence – without the help of a data scientist.

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  • B-Human Wins RoboCup World Championship with Advances in Machine Vision & AI

    B-Human Wins RoboCup World Championship with Advances in Machine Vision & AI

    The RoboCup World Cup is designed to showcase developments in the fields of artificial intelligence, computer vision, and robotics. The event’s goal is to be as close to human football as possible.

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  • Applied Materials’ Endura High-Volume Manufacturing Platforms Deliver Precision for Next-Gen MRAM, ReRAM, PCRAM Memories

    Applied Materials’ Endura High-Volume Manufacturing Platforms Deliver Precision for Next-Gen MRAM, ReRAM, PCRAM Memories

    The Endura platforms feature on-board metrology that enables new films, structures, 3D architectures, and the precision needed for advanced chip memories with improved power, performance, and cost.

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  • ERNI Extends M8/M12 Connector Portfolio with 12-, 17-pin Options for Advanced Sensors

    ERNI Extends M8/M12 Connector Portfolio with 12-, 17-pin Options for Advanced Sensors

    Multi-pin M12 variants allow engineers to reduce the number of device interfaces required in a given design, and support more complex sensor systems.

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  • Seeed Fusion Eliminates PCBA Fees for Orders of 100 or More

    The PCB Assembly service will be offered with zero operational fees on orders of more than 100 pieces through September.

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  • Lanner LEC-2580 IPC Leverages Intel AI Tech for Deep Learning-based Vision Apps

    Lanner LEC-2580 IPC Leverages Intel AI Tech for Deep Learning-based Vision Apps

    Based on Intel Core i7-6600U, Core i5-6300U, or Core i3-6100U processors with integrated Intel HD Graphics, the LEC-2580 supports Myriad X vision processing units (VPUs) and the Intel OpenVINO Tookit.

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  • ArcBlock Developer Website Accelerates Forge Blockchain App Framework, OCAP-based Blockchain Development

    The ArcBlock blockchain platform provides the foundation for setting up a local or cloud-based development environment, as well as core concepts for getting started with blockchain technology.

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  • TSMC 40ULP Process Helps Ambiq Micro Achieve 6 µA/MHz

    Combined with Ambiq’s Subthreshold Power Optimized Technology (SPOT), the 40ULP process will enable the Apollo3 wireless SoC in battery-powered designs.

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  • Dev Kit Weekly Special Edition: UDOO x86 Ultra at Sensors Expo/Embedded Technologies Conference 2019

    Dev Kit Weekly Special Edition: UDOO x86 Ultra at Sensors Expo/Embedded Technologies Conference 2019

    Stop by booth 2023 at Sensors Expo/Embedded Technologies Conference for a chance to win this week's kit, the UDOO x86 Ultra.

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  • STMicro Automotive Switching Regulator Supports Wide-Input Voltages, Multiple Reliability Features

    With a maximum input voltage of 61V, the A7987 can be driven by 24V batteries while an adjustable output from 0.8V can deliver up to 3A for a wide variety of loads.

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  • Infineon Type 4A, 4B NFC Reference Tags Approved by NFC Forum

    Infineon Type 4A, 4B NFC Reference Tags Approved by NFC Forum

    Based on the SECORA Pay security solution, the tags will be introduced at this month’s NFC Forum Member Meeting in Stuttgart, Germany.

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  • Industrial Internet Consortium Launches Maturity Assessment Explorer Tool

    Part of the IIC Resource Hub, the web-based tool highlights best practices that could be adopted by an organization while calling out areas of deficiency through a range of questions.

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  • Going for GaN – Jim Witham of GaN Systems at PCIM 2019

    Going for GaN – Jim Witham of GaN Systems at PCIM 2019

    The adoption of wide-bandgap semiconductors in the power industry is continuing to grow and develop, with the introduction of a wide array of both GaN- and SiC-based power solutions.

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  • Dev Kit Weekly: ON Semiconductor RSL10 Sensor Development Kit

    Dev Kit Weekly: ON Semiconductor RSL10 Sensor Development Kit

    This week's kit is the RSL10 Sensor Development Kit from ON Semiconductor, which boasts the industry's lowest-power Bluetooth Low Energy (BLE)/Bluetooth 5 System on Chip (SoC).

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