Brandon Lewis

Brandon Lewis, Editor-in-Chief of Embedded Computing Design, is responsible for guiding the property's content strategy, editorial direction, and engineering community engagement, which includes IoT Design, Automotive Embedded Systems, the Power Page, Industrial AI & Machine Learning, and other publications. As an experienced technical journalist, editor, and reporter with an aptitude for identifying key technologies, products, and market trends in the embedded technology sector, he enjoys covering topics that range from development kits and tools to cyber security and technology business models. Brandon received a BA in English Literature from Arizona State University, where he graduated cum laude. He can be reached by email at brandon.lewis@opensysmedia.com.

  • Embedded Toolbox: Create an IoT-Enabled Weather Panel in 15 Minutes with Renesas RA MCUs, SEGGER AppWizard & Amazon FreeRTOS

    Embedded Toolbox: Create an IoT-Enabled Weather Panel in 15 Minutes with Renesas RA MCUs, SEGGER AppWizard & Amazon FreeRTOS

    Join Brad Rex, Senior Manager in the MCU Business Unit at Renesas Electronics on this episode of Embedded Toolbox as he builds an IoT-enabled Weather Panel in just 15 minutes using an Renesas RA MCU.

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  • Dev Kit Weekly: Maxim Integrated MAX11131BOB Breakout Board

    Dev Kit Weekly: Maxim Integrated MAX11131BOB Breakout Board

    11 of you – that’s right, ten more than normal – will be saving $12.95. We have 11 MAX11131BOB Breakout Boards for winners of this week's raffle.

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  • RT-Thread Studio IDE Now Available for Open-Source IoT RTOS

    Available for free to the open-source community, RT-Thread Studio currently supports the complete line of STM32 MCUs, ST-Link and J-Link emulators, and various terminal tools.

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  • How smart is your car?

    How smart is your car?

    What an ambiguous, loaded question that has become? These days, if someone asks you “How smart is your car?” it could mean almost anything.

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  • IoT, Automotive & Power Electronics Market Survey

    Take this short survey on the IoT, automotive, and power electronics markets and in exchange we'll send you a $5 Starbucks gift card.

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  • Embedded Toolbox: Knock Out Embedded AI & Machine Learning Development Hurdles

    Embedded Toolbox: Knock Out Embedded AI & Machine Learning Development Hurdles

    There are solutions that exist in the sweet spot of the Venn diagram between artificial intelligence and embedded engineering. Tune into this week's Embedded Toolbox to learn more. It's a knockout

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  • How Smart Is Your Car?

    How Smart Is Your Car?

    What a loaded question that has become? Does it speak to your equally-smart home? Or is it simply a shrewd investment? Or, can your car determine who is driving based on how that person drives?

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  • Dev Kit Weekly: u-blox XPLR-M9 Standard-Precision GNSS Evaluation Kit

    The standard precision GNSS afforded by the XPLR-M9 actually isn’t “standard” at all by most terms. u-blox’ M9 family of GNSS chips, the XPLR kit can achieve meter-level accuracies.

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  • HCC Adds MISRA-Compliant TLS 1.3 Module to TCP/IP Networking Stack

    The small-footprint module conforms to HCC’s Advanced Embedded Framework, and is designed for microcontroller-based systems with or without an RTOS.

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  • The Embedded Insiders' Initial Thoughts on Embedded World and a Return to Analog Computing

    The Embedded Insiders' Initial Thoughts on Embedded World and a Return to Analog Computing

    Embedded World 2020 is right around the corner, and the Insiders spend a few minutes forecasting what they expect to see at the show. They interview Tom Doyle of Aspinity on analog computing in AI.

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  • Dev Kit Weekly: SiFive Learn Inventor Kit

    Dev Kit Weekly: SiFive Learn Inventor Kit

    The Learn Inventor kit is designed around one of the first commercially available RISC-V SoCs, the SiFive FE310-G003. That chip is built around SiFive’s E31 Core Complex.

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  • 2020 Embedded Processor Report: Back to the Future with Analog Computing

    2020 Embedded Processor Report: Back to the Future with Analog Computing

    Analog computing – and even analog signal processing – appears to be making a comeback. Why?

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  • Embedded Toolbox: Fast Multi-Threaded App Debug on FreeRTOS

    Tune in to learn how to identify and fix obscure bugs hidden in a complex, multi-threaded application software in under 10 minutes.

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  • Dev Kit Weekly: Renesas EK-RA6M3G Graphics Evaluation Kit

    Dev Kit Weekly: Renesas EK-RA6M3G Graphics Evaluation Kit

    Dev Kit Weekly starts 2020 off with a BANG! and the Renesas EK-RA6M3G Graphics Evaluation Kit. The kit is headlined by a new RA MCU, 4.3" cap-touch LCD screen, tons of security, and a whole lot more.

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  • Inside Open-Source Networking

    Inside Open-Source Networking

    Brandon and Rich continue their journey into the world of open source, this time by focusing on Z-Wave and LoRa/LoRaWAN.

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  • Google, Murata Integrate Coral Edge TPU in Tiny AI Module

    Google, Murata Integrate Coral Edge TPU in Tiny AI Module

    The custom-designed module measures a tiny 10 mm x 15 mm x 1.5 mm while delivering up to 4 TOPS of performance at the expense of only 2 TOPS per watt of power consumption.

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  • Vulkan 1.2 GPU Acceleration Spec Released by Khronos Group

    Vulkan 1.2 GPU Acceleration Spec Released by Khronos Group

    23 API extensions in new version of the core specification improve GPU functionality and performance.

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  • Recapping the 2020 Consumer Electronics Show

    Recapping the 2020 Consumer Electronics Show

    In this episode of Embedded Insiders, Brandon and Rich review some of the highlights from the 2020 Consumer Electroncis Show (CES).

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  • Vitrek DL Series Electronic DC Load Instruments Generate Wide-Range kW, mW or µW Loads

    Vitrek DL Series Electronic DC Load Instruments Generate Wide-Range kW, mW or µW Loads

    DL Series the platforms can support any combination of single or arbitrary loading sequences of up to 100 steps using constant voltage (CV), constant resistance (CR), constant current (CC), constant p

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  • Cadence PCB and SOLIDWORKS CAD Environments Connected by EMA’s CADSync

    Cadence PCB and SOLIDWORKS CAD Environments Connected by EMA’s CADSync

    With native bi-directional traceability and in-tool access to native CAD data structures, engineering teams can easily share high-fidelity design changes and other information that help reduce develo

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