Brandon Lewis

Brandon Lewis, Editor-in-Chief of Embedded Computing Design, is responsible for guiding the property's content strategy, editorial direction, and engineering community engagement, which includes IoT Design, Automotive Embedded Systems, the Power Page, Industrial AI & Machine Learning, and other publications. As an experienced technical journalist, editor, and reporter with an aptitude for identifying key technologies, products, and market trends in the embedded technology sector, he enjoys covering topics that range from development kits and tools to cyber security and technology business models. Brandon received a BA in English Literature from Arizona State University, where he graduated cum laude. He can be reached by email at brandon.lewis@opensysmedia.com.

  • Dev Kit Weekly – Infineon iMOTION Modular Application Design Kit

    Dev Kit Weekly – Infineon iMOTION Modular Application Design Kit

    The MADK is a three-phase motor drive evaluation platform that includes a controller and the ability to interface with intelligent power modules over an M1/M3 interface.

    Read Article
  • ASROCK INDUSTRIAL TO DISPLAY EXPERTISE AT COMPUTEX

    Global leader in industrial & embedded computing to hold a seminar, show a range of products with latest Intel & AMD chips, and much more

    Read Article
  • OneSpin, Co-Hosts Celebrate Verification Ecosystem with "Verified" at DAC

    DAC's Hottest Yearly Social Event to be Held at Topgolf Las Vegas

    Read Article
  • EFCO, congatec Partner on COM Express, SMARC, Qseven Carrier Board Design and System Integration Services

    EFCO, congatec Partner on COM Express, SMARC, Qseven Carrier Board Design and System Integration Services

    EFCO will provide standard carrier boards and customized system-level solutions for congatec’s COM Express Type 6, COM Express Type 7, SMARC, and Qseven industrial computing modules.

    Read Article
  • Percepio Tracealyzer 4.3 Features Amazon FreeRTOS Stack Analysis, Improved State Machine Analysis

    Percepio Tracealyzer 4.3 Features Amazon FreeRTOS Stack Analysis, Improved State Machine Analysis

    Tracealyzer 4.3’s Amazon FreeRTOS stack usage analysis permits developers to view the highest stack usage or each FreeRTOS task, even over sustained tests, to help them optimize RAM utilization.

    Read Article
  • Arm, Docker to Develop Cloud-Native IoT Software Development and Delivery Environment

    The software environment will accelerate the development of secure applications and services, and be made available through Docker’s commercial enterprise offerings.

    Read Article
  • GigaSpaces’ InsightEdge In-Memory Analytics Platform Achieves Red Hat OpenShift Operator Certification

    Based on Kubernetes container cluster management, OpenShift provides public cloud, on-premise, and hybrid infrastructure for migrating analytics and machine learning apps to a microservice approach.

    Read Article
  • Arm Debuts eMRAM IoT test chip with Samsung, Cadence

    The Musca-S1 test chip and an accompanying development board enable IoT SoC designers to evaluate eMRAM technology, which can scale below 40 nm to support a range of memory and power requirements.

    Read Article
  • Squirrels Research Labs Releases HBM2-based FPGA Acceleration Solutions for Blockchain

    As opposed to ASICs, the flexibility of the FPGA-based accelerators also makes them resistant to algorithm change in artificial intelligence and machine learning applications.

    Read Article
  • Dev Kit Weekly – Renesas Synergy SK-S7G2 Starter Kit

    Dev Kit Weekly – Renesas Synergy SK-S7G2 Starter Kit

    This week's kit is the Synergy SK-S7G2 Starter Kit from Renesas Electronics, a powerful entry point for embedded developers looking for an onramp to the IoT.

    Read Article
  • Newark begins shipping Particle IoT Mesh development kits based on Nordic nRF

    Newark begins shipping Particle IoT Mesh development kits based on Nordic nRF

    The Argon Wi-Fi board, Boron LTE cellular board, and Xenon Bluetooth mesh board enable maker pros to easily interface with the Particle IoT Device Cloud hosted infrastructure.

    Read Article
  • Cypherbridge SDKPac Toolkit Integrates MBAPS Modbus Protocol

    MBAPS defines client and server roles so that Modbus servers can provide TCP network access to Modbus registers. MBAPS utilizes RFC 5246 TLS 1.2 to encapsulate the Modbus protocol in TLS.

    Read Article
  • Intel’s Omnitek Acquisition Bolsters FPGA, AI Inferencing Play

    Omnitek will be integrated into Intel’s Programmable Solutions Group. The terms of the deal were not disclosed.

    Read Article
  • Rohde & Schwarz, MediaTek Validate 5G NR Capabilities in Comprehensive Network Simulation

    The test setup involved a 5G network simulation that used a 3GPP Release 15-compliant signaling connection, and validated the MediaTek chipset for use in 5G NR deployments.

    Read Article
  • Intel Arria 10-based FPGA Prototyping Systems Released by PRO DESIGN

    Intel Arria 10-based FPGA Prototyping Systems Released by PRO DESIGN

    Based on motherboards that support one, two, or four FPGA modules, engineers can use the systems to scale small-to-mid-range IP and SoC verification efforts from 8M ASIC gates to 32M ASIC gates.

    Read Article
  • Adesto Releases SmartServer IoT for Building Automation, Other Edge Use Cases

    The Linux-based multi-protocol industrial edge server provides device management services out of the box, RESTful APIs, and intuitive user dashboards.

    Read Article
  • Lauterbach Launches Full SAFERTOS Awareness in TRACE32 Arm Debug Environment

    Lauterbach has extended kernel awareness for WITTENSTEIN high integrity systems’ SAFERTOS to all Arm processors in its TRACE32 debug environment.

    Read Article
  • Hyperstone NAND Flash Use Case Tracker Optimizes Memory Configuration, Management

    The Use Case Tracker analyzes data from customer applications using a firmware extension to the Hyperstone’s hySMART tool, then recommends customized NAND Flash configurations based on the workload.

    Read Article
  • Dev Kit Weekly – Bitcraze.io Crazyflie 2.0 Drone Development Kit

    Dev Kit Weekly – Bitcraze.io Crazyflie 2.0 Drone Development Kit

    The kit comes with a battery, motor, and propellers so you can take to the skies in no time, and also allows expansion to your heart's content through a gang of serial interfaces.

    Read Article
  • GOWIN Adopts HyperBus Interface for Internal PSRAM, External HyperRAM

    GOWIN Adopts HyperBus Interface for Internal PSRAM, External HyperRAM

    HyperBus provides efficient use of package pins for high-speed interfacing with low pin count external memories, as well as internal PSRAM on GOWIN programmable devices.

    Read Article
  • loading
    Loading More...