Achronix CEO Robert Blake to Address Chinese American Semiconductor Professional Association with talk on AI/ML Hardware Challenges

October 9, 2018 Achronix
Robert Blake, President and CEO of Achronix
Robert Blake, President and CEO of Achronix

WHO: Robert Blake, president and CEO of Achronix Semiconductor Corporation, a leader in FPGA-based hardware accelerator devices and eFPGA IP

WHAT: Will offer a talk to the Chinese American Semiconductor Professional Association (CASPA) during its annual conference and banquet titled, "Addressing AI/ML Hardware Challenges." Blake will detail the ways artificial intelligence (AI) and machine learning (ML) are reshaping how the world works, opening up countless opportunities in commercial and industrial systems. His presentation will illustrate how a blend of SoC and FPGA technologies can be used to create programmable, highly parallel, hardware-accelerators that deliver the highest compute performance and lowest cost AI solutions.

 

WHEN: Saturday, October 13, at 3:15 p.m.

 

WHERE: Santa Clara Convention Center, Santa Clara

Achronix is a privately held, fabless semiconductor corporation based in Santa Clara, Calif. The company developed its FPGA technology, which is the basis of the Speedster22i FPGAs and Speedcore eFPGA technology. All Achronix FPGA products are supported by its ACE design tools that include integrated support for Synopsys Synplify Pro.

The company has sales offices and representatives in the United States, Europe, and China, and has a research and design office in Bangalore, India.

 

Follow Achronix:

 

Website: www.achronix.com

Previous Article
Western Digital Releases Industry's First 96-Layer 3D NAND UFS 2.1 Embedded Flash Drive for High-End Smartphones
Western Digital Releases Industry's First 96-Layer 3D NAND UFS 2.1 Embedded Flash Drive for High-End Smartphones

Advanced UFS-Enabled EFD Enables Always-On Experience for Data-Intensive, Next-Generation Smartphone, Table...

Next Article
KDPOF Elevates Wi-Fi Mesh Beyond 100 Mbps
KDPOF Elevates Wi-Fi Mesh Beyond 100 Mbps

Broadband World Forum: Robust In-Wall POF Backbone Raises Wi-Fi Performance to the Next Level