It’s all about efficiency when you’re talking about power supplies. However, efficiency is a tough spec to compare, as there are generally many parameters involved. So, the apples-to-apples logic generally doesn’t apply.
That said, Power Integrations' launch of the InnoSwitch3 offline flyback switcher ICs is a leader in the efficiency space, regardless of which fruit you use in your comparison.
The devices achieve up to 94 percent efficiency across line and load conditions. The result is the ability to design compact 65 W power supplies without heatsinks. This is a necessary requirement in power supplies with challenging energy consumption, footprint, or thermal constraints.
Three different lines of the InnoSwitch3 are available. The Current External (CE) series includes accurate CC/CV regulation with external output current sense for optimum design flexibility. These parts are aimed at compact single-voltage chargers, adapters, IoT, and building automation.
The Constant Power (CP) parts are suited for USB power delivery, rapid charging, and other applications where a dynamic output voltage is required. And finally, the Embedded Power (EP) devices feature the family’s highest rated MOSFET (725 V) and provide full line and load protection for industrial applications and appliances.
The InSOP-24 package provides a low-profile, thermally efficient solution with extended 11.5 mm creepage and clearance between primary and secondary sides to maximize reliability and ESD robustness. A host of protection features includes lossless line overvoltage and under-voltage, output overvoltage, over-power, over-current and over-temperature protection, and output rectifier short-circuit protection. All the parts in the InnoSwitch3 family are CCC, UL, and VDE safety-certified.
The CP and CE ICs are sampling now, priced at $1.11 (CE) and $1.15 (CP) in 10,000-piece quantities. The EP parts will be available in November at $1.18 per 10,000 pieces.eletter-09-14-2017 eletter-09-15-2017
About the Author
Richard Nass is the Executive Vice-President of OpenSystems Media. His key responsibilities include setting the direction for all aspects of OpenSystems Media’s Embedded and IoT product portfolios, including web sites, e-newsletters, print and digital magazines, and various other digital and print activities. He was instrumental in developing the company's on-line educational portal, Embedded University. Previously, Nass was the Brand Director for UBM’s award-winning Design News property. Prior to that, he led the content team for UBM Canon’s Medical Devices Group, as well all custom properties and events in the U.S., Europe, and Asia. Nass has been in the engineering OEM industry for more than 25 years. In prior stints, he led the Content Team at EE Times, handling the Embedded and Custom groups and the TechOnline DesignLine network of design engineering web sites. Nass holds a BSEE degree from the New Jersey Institute of Technology.Follow on Twitter More Content by Rich Nass