Gallium nitride, better known as GaN, is a power technology that seems forever locked in a battle with Silicon carbide, aka SiC. Is that battle a real one, or is it more a fabrication? Who better to answer that question than Larry Spaziani, a vice president at GaN Systems, who was this week’s guest in our Five Minutes with … discussion.
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Dual Gigabit Ethernet Mini PCIe expansion module released
VersaLogic Corporation has extended its line of industrial temperature, rugged Mini PCIe expansion products with the E5 Dual Gigabit Ethernet expansion board.
Smart sensors, from smoke to RF
When discussing wireless communications, I often ask people what the first wireless communications system was. I seldom get the answer I am looking for, as most do not understand my question.
How to choose cool running, high power, scalable POL regulators and save board space
IC designers often avoid dealing with the dreaded topic of heat — a job that usually falls to the package engineer.
Warming up to body heat
My last request of them was to get their input on how we could create devices that ran on “body heat”. I believe they were catching my vision while privately labeling me as crazy.
Power supply design: To build or to buy?
Followers of the OEMSecrets article series know that repairing TMI usually starts out with power supply trouble. Due to that, buying an off-the-shelf module can be attractive.
Power Your Bus With Supercapacitors
Electric buses are great for fuel savings and also for the environment. Power them with supercaps to really maximize that efficiency.
7 Hands-On Workshops Highlight Free ST Developers Conference – Register Today
technical hands-on sessions are presented by subject-matter experts and show attendees how to optimize performance, size, power consumption, and cost of their products.
Clientron introduces its multi-functional PST650 POS terminal with integrated printer to enhance intelligent retail and hospitality solution
Clientron introduces the PST650, a fully integrated POS terminal, features built-in the choice of major brand thermal printers to optimize your business operations and enhance user experience....
Pixus announces new compact OpenVPX backplane
Pixus Technologies, a provider of embedded computing and enclosure solutions, now offers a 3U, 3-slot OpenVPX backplane for small Mil/Aero and other applications where size, weight, and power is...
Maxim's secure microcontroller delivers advanced cryptography, secure key storage and tamper detection in a 50 percent smaller package
MAX32558 DeepCover IC enables faster and simpler design of robust security capabilities into industrial, consumer, computing and IoT applications
Advanced Bluetooth Angle Estimation Techniques Enhance Real-Time Locationing
Bluetooth Angle of Arrival and Departure are the latest techniques for real-time tracking of people, mobile devices, and other assets.
Leti and CMP announce multi-project wafer service with integrated silicon OxRAM
Leti, a research institute at CEA Tech, and CMP, a service organization that provides prototyping and low-volume production of ICs and MEMS, today announced the integrated-circuit industry's first...
Create high-resolution audio devices using Microchip's new Bluetooth Audio SoC with Sony's LDAC technology
Bluetooth 5-compliant SoC enables immersive audio sound in Audeze's award-winning, high-end Mobius gaming headphones
Advantech at Taipei Int’l Industrial Automation Exhibition
Patrick Hopper, Publisher of Embedded Computing Design, interviews David Yeh, Private Cloud Product Manager at Advantech. David discusses the company's WISE-Paas solution and Industry 4.0.
Securing Industrial IoT sensors, part 1: The TPM for network security
For connected devices, low protected edge nodes, such as sensors, provide entry points to high value targets and sophisticated attacks.
First congatec SMARC 2.0 module with NXP i.MX8 processor
Best-in-class ARM processor in application friendly shape
New frontiers in automotive HMI and display design
HMI designs are now employing artificial intelligence (AI) technologies to reduce driver distractions through a new breed of gesture-recognition features.
The future of vehicle connectivity
As automotive technologies continue to mature, new vehicle sensors are now capable of predicting impending collisions, identifying pedestrians and cyclists, and more.
MPCIe module for IoT and fleet management
Innodisk (Taiwan) showed at Embedded World 2018 the EMUC-B202 module, which can be installed via mPCIe or USB pin header.
Smart sensors: The reality of Sci-Fi