Sensors Expo 2015: Quick hits - LeddarTech optical time of flight and ZMDI sensor signal conditioning round out 30th Sensors Expo

June 23, 2015 OpenSystems Media

I was running behind and had to catch a flight at LAX (which I ended up missing anyway thanks to a subpar Uber driver), so my stop bys at the LeddarTech and ZMDI booths were brief. However, in the short amount of time, I was able to tweet about LeddarTech’s cool optical time-of-flight technology chip technology (LeddarTech is also currently offering a discounted sensor evaluation kit), as well as ZMDI’s sensor signal conditioning chip, which includes both resistive and differential bridge interfaces in addition to two external temp interfaces.

 

[Figure 1 | The ZMDI ZSSC3154 sensor signal conditioning (SSC) IC used in this demo includes a resistive bridge interface, a differential bridge interface, and two external temperature interfaces that reduce calibration testing headaches for developers.]

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Brandon Lewis, Technology Editor
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