AI & Machine Learning

  • Innodisk Showcasing AIoT at Embedded World 2019

    Innodisk is bringing its AIoT-ready solutions for embedded industrial memory, storage, and expansion at Embedded World 2019 in Nuremberg, Germany.

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  • Vecow Presenting GPU Computing Systems at Embedded World 2019

    Vecow will be attending Embedded World 2019 presenting computing solutions built for machine vision, deep learning, and industrial AI applications.

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  • NXP Showcasing Neutral Networking, AI, and Autonomous Driving Products at Embedded World 2019

    NXP Semiconductors will showcase various technologies for a collection of AI-related applications at embedded world 2019.

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  • UltraSoC to Present Extended Embedded Analytics Architecture at embedded world

    UltraSoC will present its extended embedded analytics architecture at embedded world.

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  • The Journey from Prototype to Production for AI at the Edge

    Intel is building an AIoT, AI + IoT, ecosystem through its Intel® IoT Solutions Alliance to accelerate prototype to production at the edge.

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  • eSilicon builds momentum as a strong tier one FinFET ASIC supplier

    Best-in-class IP and multiple FinFET/2.5D product bring-up programs set a rapid pace

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  • DVCon Panel to Explore How AI/Deep Learning will Reshape the Verification Landscape

    Mentor's Jean-Marie Brunet Discussion to Lead Discussion with Executives from Achronix, AMD, Arm, Mythic, NVIDIA

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  • Embedded Computing Design to Host Complimentary Engineering Education Tracks at Embedded World 2019

    Embedded Computing Design to Host Complimentary Engineering Education Tracks at Embedded World 2019

    Developed in partnership with leading AI, IoT, and Industry 4.0 tech organizations, the free seminars will educate attendees on engineering megatrends and practical solutions for capitalizing on them.

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  • Canonical Returns to Embedded World 2019

    Canonical will be demonstrating how organizations can bring their IoT solutions to market quicker using snaps and Ubuntu Core 18 at embedded world 2019.

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  • ISSCC 2019: eSilicon to present a paper and demonstrate 7nm 56G DSP SerDes operation over a five-meter cable assembly

    "A Sub-250mW 1-to-56Gb/s Continuous-Range PAM-4 42.5dB IL ADC/DAC-Based Transceiver in 7nm FinFET" Will be Presented Monday, February 18, from 2:30-3 p.m.

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  • Vecow Showcases Smarter Industrial AI Engines At Embedded World 2019

    Vecow Showcases Smarter Industrial AI Engines At Embedded World 2019

    Featuring Smarter Industrial AI Engines, Vecow would like to share you her latest solutions for industrial AI computing at Embedded World 2019 from February 26th to 28th, Nuremberg, Germany. The...

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  • VIA Mobile360 ADAS System Introduced at Embedded World 2019

    Via Technologies, Inc. will be attending embedded world 2019 to exhibit VIA Mobile360 ADAS, their Edge AI solution for smart transportation.

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  • Analog Devices to Attend Embedded World

    Analog Devices’ will be appearing at embedded world 2019, focusing on machine learning and artificial intelligence.

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  • Yole Report Identifies AI, HPC as Key Drivers of 2.5D, 3D TSV tech

    Yole Report Identifies AI, HPC as Key Drivers of 2.5D, 3D TSV tech

    According to “2.5D / 3D TSV & Wafer Level Stacking: Technology & Market Updates,” the stacking technologies market is expected to grow at a CAGR of 27 percent to more than $5.5 billion in 2023.

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  • Nanotron and Schaeffler Technologies’ FreiForm Project Improves Autonomous Sensors

    Nanotron Technologies GmbH and Schaeffler Technologies' FreiForm, developed compact, intelligent, autonomous sensors, also known as 'smart Items,' of any shape or form.

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  • Socionext Uses AI for People Recognition in a Snap

    DeepVision’s products generally lie at the edge of the IoT, and combined with the expertise of Socionext, full-fledged SoCs can be realized.

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  • Newark element14’s New Research Shows Hardware’s Important Role in IoT Design

    Premier Farnell and Newark element14's new research on IoT reinforces hardware platforms’ pivotal role in the early phases of the design process.

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  • Software Simplicity: The Solution to Vision at the Edge

    The Intel Distribution of OpenVINO toolkit enables developers to streamline the deployment of deep learning inference and high-performance computer vision applications in use cases at the edge.

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  • MATRIX Voice from MATRIX Labs available from Newark element14

    Platform enables users to integrate custom voice and hardware-accelerated machine learning technology right onto the silicon

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  • OpenFog Now Part of Industrial Internet Consortium

    The combined organization is now the largest entity guiding Industrial IoT, AI, fog, and edge computing development.

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