Brewer Science Expands Printed Electronics Capabilities

June 25, 2019 Alix Paultre

Brewer Science (BSI) is expanding its printed electronics program to incorporate service capabilities, categorized into three major core competencies: printing, electronics and software. BSI has a wide range of printing capabilities for flexible-hybrid electronics (FHE) and other printing needs. Its state-of-the-art equipment can accommodate both screen printing and spray coating. Additionally, the company can provide multilayer, front and back printing services with optical layer alignment for a variety of substrates and inks.

BSI has partnered with customers to provide solutions for both FHE and traditional printed circuit boards (PCBs). These turn-key, integrated FHE solutions services include flexible circuit board design, lay out, manufacturing, communications, firmware, and population, laser cutting and engraving, data transport and storage, device testing and consulting. In addition, BSI’s ancillary capabilities are now available to customers, and include computer-aided design (CAD) schematics capture, PCB layout, laser cutting and engraving, and data transport and analysis. 

Sensors Expo

Brewer Science will be exhibiting and presenting at the Sensors Expo and Conference in San Jose, CA. from June 25-27, 2019. Visit Booth 1422 at the San Jose Convention Center. Additionally, BSI will host a free afternoon workshop at 1:00 p.m. on June 26 with other industry leaders focusing on ‘Next Generation Sensing: Printed Sensors.’ The presenters will delve into the current state of the printed sensors market, where it’s headed, and which applications will be the next to adopt this exciting technology.

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