TI Robotics System Learning Kit available from element14

July 9, 2018 Brandon Lewis

The Texas Instruments Robotics System Learning Kit (TI-RSLK), an affordable robotics kit developed to educate future engineers about system-level design, is now available from Newark element14. Intended for use in university settings to teach students the necessary background for designing, testing, and building functioning robotics systems, the kit is paired with a 20-module curriculum created by University of Texas at Austin professor Jon Valvano.

The TI-RSLK Maze Edition features the SimpleLink MSP432P401R microcontroller (MCU) LaunchPad development kit, and includes more than 60 electronic and mechanical components. The SimpleLink MCU platform offers a broad portfolio of connected Arm-based MCUs and a unified software development environment. The TI-RSLK Maze Edition can be customized based on educational goals, and is available from Newark element14 in three off the shelf options:

  • TI-RSLK Basic is intended to teach the principles of electronic system design, and uses the SimpleLink MSP432P401R MCU LaunchPad Development Kit as a reference.
  • TI-RSLK Advanced builds on the Basic kit by adding wireless communications concepts. It leverages the SimpleLink Bluetooth low energy (BLE) CC2650 module BoosterPack plug-in module and SimpleLink Wi-Fi CC3120 wireless network processor BoosterPack plug-in module.
  • The TI-RSLK Upgrade kit can be added to the Basic kit to create an Advanced kit.

The TI-RSLK kits are available for purchase from Newark element14 in North America, Farnell element14 in Europe, and element14 in APAC. More information is available at www.element14.com/rslk.

About the Author

Brandon Lewis

Brandon Lewis, Editor-in-Chief of Embedded Computing Design, is responsible for guiding the property's content strategy, editorial direction, and engineering community engagement, which includes IoT Design, Automotive Embedded Systems, the Power Page, Industrial AI & Machine Learning, and other publications. As an experienced technical journalist, editor, and reporter with an aptitude for identifying key technologies, products, and market trends in the embedded technology sector, he enjoys covering topics that range from development kits and tools to cyber security and technology business models. Brandon received a BA in English Literature from Arizona State University, where he graduated cum laude. He can be reached by email at brandon.lewis@opensysmedia.com.

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