At the OCP Summit 2019, the Power Stamp Alliance (PSA) announced a reference design board for processors based on the next-generation “Ice Lake” 10nm Intel CPU microarchitecture. PSA 48V direct-conversion DC-DC modules (power stamps) target advanced IT equipment and large data processing installations.
The reference design board enables design engineers to evaluate the power stamp concept and specific point-of-load stamps from dc-dc vendors. This reference design board extends the Power Stamp Alliance’s portfolio, which includes a board suitable for the Intel Skylake VR13 processor architecture and a board for ASIC devices.
For more information, visit www.powerstamp.org.