Geoff Lees, VP/GM of MCUs at NXP explains the latest i.MX microprocessor announcement, aimed at the Edge of the IoT. It offers a 600-MHz frequency, improved memory performance, and integrated power-management functionality. For more information on NXP, visit www.nxp.com. For more things that you missed at ARM TechCon 2017, click here.
- Machine Learning
- Power Electronics
- Dev Tools & OS
- Dev Kit Selector
- White Papers
- Upcoming Activities & Events
- embedded world 2020
- Embedded Executive
We also recommend:
New Switch Fabric Module Boosts Data Center Processing Capability for Aerospace and Defense Applications
OpenVPX PCIe technology mirrors composable data center architecture to accelerate processing-intensive applications at the tactical edge.
Imperas to Demonstrate Solutions for RISC-V Processor Verification and Extensions at Embedded World, Nuremberg 2020
We will be co-sponsoring the RISC-V Foundation stand at the Embedded World Exhibition and Conference in Nuremberg, 25-27 February 2020. Hall 3A, stand 536.
The Embedded Insiders' Initial Thoughts on Embedded World and a Return to Analog Computing
Embedded World 2020 is right around the corner, and the Insiders spend a few minutes forecasting what they expect to see at the show. They interview Tom Doyle of Aspinity on analog computing in AI.
Fujitsu Releases 3-Channel, 24GHz Doppler Radar Sensor Module
Fujitsu Components America introduced the FWM7RAZ01, a 3-channel, 24GHz Doppler radar sensor with a wide speed-detection range and high interference tolerance.
Dev Kit Weekly: SiFive Learn Inventor Kit
The Learn Inventor kit is designed around one of the first commercially available RISC-V SoCs, the SiFive FE310-G003. That chip is built around SiFive’s E31 Core Complex.
Everything You Need to Know about Obtaining Audio Certification
With rising demand, competition, and evolution of technology in the audio devices industry, the need for quality user experience for immersive and high quality sound output is increasing significant.
2020 Embedded Processor Report: Back to the Future with Analog Computing
Analog computing – and even analog signal processing – appears to be making a comeback. Why?
Dev Kit Weekly: Renesas EK-RA6M3G Graphics Evaluation Kit
Dev Kit Weekly starts 2020 off with a BANG! and the Renesas EK-RA6M3G Graphics Evaluation Kit. The kit is headlined by a new RA MCU, 4.3" cap-touch LCD screen, tons of security, and a whole lot more.
Google, Murata Integrate Coral Edge TPU in Tiny AI Module
The custom-designed module measures a tiny 10 mm x 15 mm x 1.5 mm while delivering up to 4 TOPS of performance at the expense of only 2 TOPS per watt of power consumption.
Vulkan 1.2 GPU Acceleration Spec Released by Khronos Group
23 API extensions in new version of the core specification improve GPU functionality and performance.
GreenWaves’ Ultra-Low Power GAP9 IoT Apps Processor Suits Intelligence at the Edge
GAP9 lets OEMs embed machine learning and signal processing capabilities into battery-powered or energy-harvesting devices.
Winmate Unveils 7" Rugged Arm-Based Tablet M700DQ8 with Qualcomm Snapdragon™ Processor
Ideal for field data capture in nearly any industry and application.
MYIR Introduces $29 ARM SoM Powered by ST STM32MP1
The MYC-YA157C CPU Module is a powerful and low-cost SoM for various embedded applications.
STMicroelectronics Combines STM32 MCU and LoRa Transceiver on One SoC
STMicroelectronics introduced what it claims is the industry’s first LoRa system-on-chip (SoC). Previously, the LoRa device was a separate transceiver that connected to a microprocessor.
Inside the Black Box
Most software is obtained as a binary executable. The program may run and does what it does, but the user has no knowledge of its inner workings and has no opportunity to modify its functionality.
TI’s Jacinto 7 Processors Enable Automotive ADAS and Gateway Applications
Texas Instruments (TI) released a new series of microprocessors, the Jacinto 7 line. It was introduced at CES amid a series of demos.
Analog and Digital Discovery Tools Address the Demands of Professional Engineers
D3 Engineering Launches Automotive Vision Development Kit Based on TI TDA4VM SoC
The production-intent kit was designed to automotive temperature ranges and includes an automotive-grade power design with reverse battery protection, helping accelerate the design of ADAS systems.
COM-HPC: Limitless High-Speed Scalability
Scheduled for the first half of 2020, there is still some time to go before the final PICMG ratification of the COM-HPC specification.
NXP Debuts i.MX Applications Processor with Neural Processing Unit for Advanced Machine Learning