MIPI CSI-2 v3.0 Enhances Imaging, Reduces Cabling for Embedded Systems Designers

October 2, 2019 Brandon Lewis

The MIPI Alliance has updated its Camera Serial Interface-2 (CSI-2) specification with Unified Serial Link (USL), Smart Region of Interest (SROI), and RAW-24 features. Version 3.0 of the specification is also accompanied by new tools and companion specifications for developer enablement, including the MIPI Camera Command Set (MIPI CCS) and a Conformance Test Suite (CTS).

The MIPI CSI-2 v3.0’s USL feature encapsulates connections between image sensors and applications processors to minimize the required number of wires. SROI can be used to analyze images more efficiently, while RAW-24 delivers 24-bit precision rendering of image pixels.

MIPI CCS for CSI-2 v3.0 defines standard functions for implementing and controlling MIPI-based sensors that will reduce driver development and integration costs. It will be released later this year. MIPI CSI-2 and MIPI CCS can be implemented on MIPI’s C-PHY or D-PHY physical layers.

The CTS for CSI-2 v3.0 defines interoperability tests, and is available now.

CSI-2 v3.0 is the second step in a three-phase process of expanding the technology from mobile phones to automotive, medical, IoT, and other embedded systems. The process will culminate with another version of CSI-2 that targets ultra-low-power, always-on interfacing, data protection, and functional safety, as well as the MIPI A-PHY physical layer specification.

For more information, visit the MIPI website or attend MIPI DevCon Taipei on October 18, 2019.

About the Author

Brandon Lewis

Brandon Lewis, Editor-in-Chief of Embedded Computing Design, is responsible for guiding the property's content strategy, editorial direction, and engineering community engagement, which includes IoT Design, Automotive Embedded Systems, the Power Page, Industrial AI & Machine Learning, and other publications. As an experienced technical journalist, editor, and reporter with an aptitude for identifying key technologies, products, and market trends in the embedded technology sector, he enjoys covering topics that range from development kits and tools to cyber security and technology business models. Brandon received a BA in English Literature from Arizona State University, where he graduated cum laude. He can be reached by email at brandon.lewis@opensysmedia.com.

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