Micross Will Present Microelectronic Products & Services at Electronica 2018

November 12, 2018 Laura Dolan

Micross will be at Electronica 2018, November 13-16, in Munich, Germany in Hall C5, Booth 436. Products on display will include: 

  •     Bare Die & Wafer Processing

Broadest Access to Bare Die 30+ Manufacturers

  •     Advanced Interconnect Technology

Wafer Bumping / Wafer-Level Packaging

  •     Packaging & Assembly

Optoelectronic & Silicon Photonics Assembly

  •     Component Modification

BGA Reballing / Column Grid Array (CGA)

  •     Advanced Testing Services: Electrical & Environmental Test

FPGA, ASIC, RF Test / Life Test & Burn-in

  •     Hi-Rel Products

SMD/5962 & Extended Temperature Plastic

For additional information, visit http://www.micross.com.

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