Lattice Semiconductor Releases New CrossLink Reference Design

July 17, 2019 Laura Dolan

Lattice Semiconductor Corporation launched its SubLVDS to MIPI CSI-2 Image Sensor Bridge reference design. It offers a flexible, easy-to-implement solution for industrial device customers for connecting advanced application processors (APs) with image sensors being used in modern machine vision applications for industrial environments.

The SubLVDS to MIPI CSI-2 Image Sensor Bridge includes:

·        4, 6, 8, or 10 lane SubLVDS input to 1, 2, or 4 lane MIPI CSI-2 output

·        Up to 1.2 Gbps bandwidth per input lane

·        Up to 1.5 Gbps bandwidth per output lane

·        Dynamic parameter setting via I2C

·        Optional support for image cropping

“In industrial environments, customers are interested in upgrading legacy machine vision applications to take advantage of the processing capabilities and feature sets of new APs,” said Lattice Semiconductor’s Product Marketing Manager, Peiju Chiang. “Rather than devote precious time and engineering resources on an extensive device redesign, the Lattice CrossLink SubLVDS to MIPI CSI-2 Image Sensor Bridge reference design provides a simple workaround that addresses legacy interface compatibility issues to get redesigned products to market quickly and cost effectively.”

Learn more at www.latticesemi.com.

Previous Article
Smart World of IoT– Cutting the Cord: The Power Supply Ones!

In this column, we are exploring power requirements and optimization of IoT design.

Next Article
SEMI and FIRST Global Join Forces to Encourage the Pursuit of STEM Education and Careers

SEMI formed a memorandum of understanding (MOU) with FIRST Global to help make the FIRST Global Challenge m...