Kyocera and Vicor will collaborate on next-generation Power-on-Package solutions, to maximize performance and minimize time-to-market for emerging processor technologies. As a part of the collaboration, Kyocera will provide the integration of power and data delivery to the processor with organic packages, module substrates, and motherboard designs, and Vicor will provide Power-on-Package current multipliers, enabling high density and high current delivery.
This collaboration will address higher-performing processors, which has created proportionate growth and complexity in high-speed I/Os and high-current consumption demands. Vicor’s high-efficiency Power-on-Package technology enables current multiplication within the processor package, which can reduce interconnect losses by up to 90 percent, while allowing processor package pins, typically required for high current delivery, to be reclaimed for expanded I/O functionality.
Kyocera has cultivated design expertise by applying Vicor's Power-on-Package devices in multiple applications, and by using their simulation tools and manufacturing experience to create optimal designs for complex I/O routing, high speed memory routing, and high-current power delivery. Through this collaboration, Kyocera and Vicor intend to bring new solutions for AI and high-performance processor applications to market.