Dev Kit Weekly: T.I. SimpleLink Multi-Band CC1352R Wireless MCU Launchpad SensorTag Kit

June 26, 2020 Brandon Lewis

The Texas Instruments family of LaunchPad development platforms has been around for quite some time, and were some of the first kits available to really help IoT developers get off the ground quickly with wireless designs.

Well, this latest sibling takes wireless engineering to a new heights, integrating the dual-band, multi-protocol CC1352R SimpleLink wireless MCU that supports both 2.4 GHz technologies like Bluetooth, Bluetooth 5 Low Energy, Zigbee, and Thread, as well as Sub-GHz connectivity. That combination has some pretty big implications for IoT systems, as a single CC1352R MCU allows devices to concurrently tap into a local point to point network, mesh network, and/or low-power, wide-area network with ranges of more than a kilometer.

Surprisingly, the CC1352R enables this advanced networking functionality using just a single Arm Cortex-M4F core that clocks in at power-sipping 48 MHz, 352 kilobytes of in-system programmable flash, and 80 kilobytes of low-leakage SRAM, and 256 kilobytes of ROM where users can store library functions and protocols, like the TI-15.4 802.15.4 stack, 6LoWPAN, the MIOTY standard, proprietary Sub-GHz stacks, and the aforementioned 2.4 GHz options.

Also housed in the ROM are drivers, a bootloader, and TI-RTOS kernel, which manages the multiple simultaneous network threads. Users can access the TI-RTOS via APIs in the SimpleLink SDK that’s provided for free with the LaunchPad kit.

If you’d like to learn more about the CC12352R LaunchPad, you can check it out on dev.ti.com or the Digi-Key website. Or, check out the video rundown of the kit below.

If you’ve heard enough and want one now, you can purchase one for just $30. Or, thanks to this week’s sponsor, you can potentially win one for free by entering this week’s raffle. To do so, just fill out this form.

Good luck in the raffle. Thanks for watching. And we’ll see you next week on Dev Kit Weekly.

About the Author

Brandon Lewis

Brandon Lewis, Editor-in-Chief of Embedded Computing Design, is responsible for guiding the property's content strategy, editorial direction, and engineering community engagement, which includes IoT Design, Automotive Embedded Systems, the Power Page, Industrial AI & Machine Learning, and other publications. As an experienced technical journalist, editor, and reporter with an aptitude for identifying key technologies, products, and market trends in the embedded technology sector, he enjoys covering topics that range from development kits and tools to cyber security and technology business models. Brandon received a BA in English Literature from Arizona State University, where he graduated cum laude. He can be reached by email at brandon.lewis@opensysmedia.com.

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