Vincotech announced it has extended the power range of its flow E1/E2 product family, and is available in PIM (CIB) and six pack configurations for 25A, 50A and 100A. These packages feature a 12 mm-high low-inductive housing with two lateral mounting screws, Press-fit pins or solder pins, and no baseplate. The housing's footprint and pin-out are fully compatible with standard industry packages.

The design of flow E1/E2 housings is optimized to provide a solid mechanical contact to the heat sink and achieve superior thermal performance with 15 percent lower Rth than competing products. These modules also shoehorn higher power density into a smaller package.

Learn more at www.vincotech.com.