Vishay Intertechnology introduced an 80V TrenchFET Gen IV n-channel power MOSFET in the 6.15mm x 5.15mm PowerPAK SO-8 package. The Vishay Siliconix SiR680ADP offers an on-resistance times gate charge figure of merit (FOM) of 129 mΩ*nC, with an on-resistance down to 2.35 mΩ typical at 10V, a gate charge of 55 nC, and COSS of 614 pF. The MOSFET is 100 % RG- and UIS-tested, RoHS-compliant, and halogen free.
Packetworx is one of the companies leading in IoT innovations and was at the time running trials for a smar...
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New development toolsuite provides consistency across guest operating systems and is designed to enhance project productivity.
STMicroelectronics released an Amazon-qualified reference design package for smart connected devices leveraging Alexa Voice Service (AVS) Integration for AWS IoT Core.
Macnica ATD Europe announced its parent company, Macnica, is now offering Macnica SLVS-EC IP versions for both Intel and Xilinx devices.
Vishay Intertechnology released a new series of automotive-grade miniature aluminum electrolytic capacitors that couple high ripple currents up to 3.8A with temperature operations up to +105 °C.
PRBX announced the release of the ENR500D, a 500W platform designed to comply with the EN 50124-1 standard and for the Pollution Degree 2 (PD2).
Xilinx announced a collaboration with Texas Instruments (TI) to develop digital front-end (DFE) solutions in an effort to increase energy efficiency of lower antenna count radios.
EdgeQ Announced its launch from stealth with $51 million in total funding, including $38.5 million in a Series A round.
Reference Design Combines OmniVision’s Dual-Mode Global Shutter Image Sensor for Both RGB and IR Imaging With Ambarella’s AI Vision Processor and Smart Eye’s AI DMS Software Algorithm
The newest member of the Digi IX industrial cellular router family, can operate well with digital signage, asset monitoring, and retail applications
Today, the security of medical devices is becoming extremely important to assure customers & patients that interact with your devices that their health & their personal information is taken seriously.
PREEvision 9.5.4 from Vector allows wiring harness designers and architects to get views on the data they are working on with an intelligent auto-layout algorithm.
ADLINK Technology is an official sponsor of the Indy Autonomous Challenge (IAC), scheduled for October 23, 2021.
Winbond Electronics Corporation announced that its W75F Secure Flash memory device with Common Criteria EAL5+ certificate, has achieved the ISO26262 ASIL Grade D safety certification.
Results Highlight “Zero Effort” Architecture Benefits for Computing Neural Networks.
With reliability as a key influence on both partners, this collaboration allows for mission-critical device manufacturers with first-class safety, reduced R&D costs, and faster time to production.
Test and measurement specialist Rohde & Schwarz extends its support to the University of New Hampshire Interoperability Laboratory (UNH-IOL) with an extension to their compliance test services.
Microchip’s new TrustAnchor device provides OEMs and their module suppliers with a simplified path to automotive network security, reducing costs and time to market.
Reference Design with SMARC 2.0 Form Factor Offers Choice of Three RZ/G2 MPUs for Scalable Performance in AI IoT Face/Object Detection & Image Processing Applications
AMD launched a new product in its Embedded processor family, the AMD Ryzen Embedded V2000 Series processor.
IAR Systems announced the availability of the IAR KickStart Kit™ for Renesas’ R-IN32M4-CL3