Trinamic Ultra-Silent Stepper Motor Driver Integrates Step/Direction Interface

May 19, 2020 Brandon Lewis
TRINAMIC has released the TMC2226, a dynamic two-phase bipolar stepper motor driver that delivers supply voltages ranging from 4.75 to 29V and a peak current of up to 2.8A. A microPlyer interpolation unit provides 256 subdivisions for fine-grained sinusoidal control even in systems with limited pulse frequencies.
 
 
TMC2226 drivers can be programmed through a single-wire UART, and settings can be saved in a one-time programmable (OTP) memory on the device. This allows the drivers to be used for standalone motion tasks thanks to an internal pulse generator.
 
The devices also incorporate a step/direction interface with 8, 16, 32, or 64 microstep pin setting options.
 
"The step/direction interface is still the most common interface used by motion controllers to communicate with stepper motor drivers," said Michael Randt, founder and CEO of Trinamic. "With the step/dir interface, the TMC2226 stepper driver IC makes it easy for engineers to upgrade existing designs and to develop new applications." 
 
StealthChop2 choppers within the TMC2226 stepper drivers improve efficiency, motor torque, and enable noiseless stepper motor operation, while the built-in SpreadCycle feature helps further minimize noise and vibration when driving motors at high speeds. To improve energy efficiency, the drivers utilize take advantage of low RDSon and automatic power down.
 
Additional features include StallGuard4 for sensorless load and stall detection, passive braking, freewheeling, and an optional internal sense resistor.
 
TMC2226 stepper motor drivers are packaged in a 9.7 mm x 6.4 mm HTSSOP28 housing. The ICs, evaluation boards, and breakout boards are available now. Visit the Trinamic website for more information: https://www.trinamic.com/products/integrated-circuits/details/tmc2226-sa/.

About the Author

Brandon Lewis

Brandon Lewis, Editor-in-Chief of Embedded Computing Design, is responsible for guiding the property's content strategy, editorial direction, and engineering community engagement, which includes IoT Design, Automotive Embedded Systems, the Power Page, Industrial AI & Machine Learning, and other publications. As an experienced technical journalist, editor, and reporter with an aptitude for identifying key technologies, products, and market trends in the embedded technology sector, he enjoys covering topics that range from development kits and tools to cyber security and technology business models. Brandon received a BA in English Literature from Arizona State University, where he graduated cum laude. He can be reached by email at brandon.lewis@opensysmedia.com.

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