ROHM and GaN Systems are collaborating in the gallium nitride (GaN) power semiconductor business, with the goal of contributing to the continuing evolution of power electronics. The companies have agreed to jointly develop form-, fit-, and function-compatible products using GaN semiconductor dies in both GaN Systems’ GaNPX packaging and ROHM’s traditional power semiconductor packaging. GaN Systems and ROHM will also work together on GaN semiconductor research and development activities to propose solutions for the industrial, automotive, and consumer electronics fields. And to contribute to greater energy savings and increased power densities in the power electronics market, both companies will continue to collaborate to expand their line-up of GaN products and broaden the range of choices.
- Embedded Security Webinar Series
- Machine Learning
- Power Electronics
- Dev Tools & OS
- Dev Kit Selector
- White Papers
- Upcoming Activities & Events
- Embedded Executive
The device supports high frames per second (FPS) cameras and dynamic facial recognition software.
Most Recent Articles
Ibeo confirms ams VCSEL technology is a core component within LiDAR systems.
KEMET released the Tantalum Stack Polymer (TSP) O 7360-43 and the 82uF/75V rated voltage extension in Polymer Hermetically Sealed.
By 2022, an operational stock of almost 4 million industrial robots are expected to work in factories worldwide.
Rapid GUI development capabilities of Storyboard make addition of new functions to VOCSN critical care ventilators possible in under 30 days.
The goal of this free trial is to help prospective users and customers evaluate all the different features and capabilities of the latest Mender releases.
MediaTek announced it has enhanced its collaboration with Intel to further the 5G experience in next-generation PCs with development and certification of its 5G modem data card, the T700.
A new survey reveals that COVID-19 and remote working could have a lasting impact on the autonomous vehicle industry.
Key features of the zeptoSMDC PPTCs include a small 0201 surface-mount package and the ability to reset to normal operation once a fault has cleared.
OpenXR is an open, industry standard API that enables the development and deployment of portable, cross-platform AR/VR (XR) runtimes.
Portwell announced it has joined Microsoft Azure Certified for Internet of Things (IoT), assisting customers to get solutions running with pre-tested and verified hardware and software.
Renesas announced the sample shipments availability of the RYZ012 Bluetooth® module which targets ultra-low power IoT applications.
Google announced that its Google Science Journal is transferring from Google to Arduino, September 2020.
KDPOF Supports Complete, Compatible and Interoperating Implementation of Automotive Networks with 1 Gigabit per Second.
The RA microcontroller ecosystem has expanded with security, machine learning, and other building block solutions from partners like Arm, Alibaba, IAR, Qeexo, Qt, Toshiba, and wolfSSL.
Laird Connectivity announced the release of the Sentrius BT710 tracker for real-time social distancing and contact tracing.
Global Telecom released updates to its TITAN line of advanced modems, this includes the TITAN 5000, a smart 5G indoor modem.
ONE Tech estimates that MicroAI Atom algorithms, which run recursive analysis and reside directly on target MCUs at the edge, reduce the cost of deploying endpoint intelligence by a minimum of 80%.
Fibocom decides to acquire Sierra Wireless Automotive Embedded Module Product Line through its Joint Venture Company
The currently available Verdin SoMs feature the new NXP i.MX 8M Mini/Nano applications processors.
The Orange Crab is a crowd-funded platform designed to Adafruit’s 50.8 mm x 22.9 mm Feather board specification, and supports all open-source toolchains.