Raspberry Pi 3 Model B+ connects with Cypress Wi-Fi/Bluetooth combo SoC

March 16, 2018 Brandon Lewis

SAN JOSE, CA. Cypress Semiconductor has announced that its CYW43455 802.11ac and Bluetooth/Bluetooth Low Energy combo chip provides connectivity and wireless coexistence ability for the Raspberry Pi 3 Model B+ Internet of Things (IoT) single-board computer. The CYW43455 offers high-performance Wi-Fi, coexistence algorithms for simultaneous Bluetooth operations, and low-power connections to sensors, smartphones, and Bluetooth Mesh networks to ensure connectivity.

The Cypress CYW43455 SoC features a dual-band 2.4- and 5-GHz radio with 20-, 40- and 80-MHz channels with up to 433 Mbps performance helping ensure consistent wireless connectivity. The SoC includes open-source Linux Full Media Access Control (FMAC) driver support with enterprise and industrial features enabled, and is also supported by the Wireless Internet Connectivity for Embedded Devices (WICED) software development kit (SDK).

The Raspberry Pi 3 Model B+ board features a 64-bit, quad-core processor running at 1.4GHz, 1GB RAM, full size HDMI and 4 standard USB ports, Gigabit Ethernet over USB2, Power over Ethernet capability, CSI camera connector and a DSI display connector.

“Achieving reliable wireless connectivity in crowded airwaves is a foremost concern for developers of industrial IoT and smart home systems, which lead us to select Cypress’ 802.11ac combo SoC for the Raspberry Pi 3 Model B+ board,” said Eben Upton, CEO of Raspberry Pi Trading. “Our new board democratizes high-performance, interoperable and highly reliable 802.11ac Wi-Fi for use across a huge range of IoT products.”

More information on the Cypress CYW43455 SoC can be found at www.cypress.com/802.11ac. More on the Raspberry Pi 3 Model B+ is available at www.raspberrypi.org/products/raspberry-pi-3-model-b+.


About the Author

Brandon Lewis

Brandon Lewis, Editor-in-Chief of Embedded Computing Design, is responsible for guiding the property's content strategy, editorial direction, and engineering community engagement, which includes IoT Design, Automotive Embedded Systems, the Power Page, Industrial AI & Machine Learning, and other publications. As an experienced technical journalist, editor, and reporter with an aptitude for identifying key technologies, products, and market trends in the embedded technology sector, he enjoys covering topics that range from development kits and tools to cyber security and technology business models. Brandon received a BA in English Literature from Arizona State University, where he graduated cum laude. He can be reached by email at brandon.lewis@opensysmedia.com.

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