OmniVision Unveils Automotive Wafer-Level Camera Module

June 2, 2020 Tiera Oliver

OmniVision Technologies announced the OVM9284 CameraCubeChip module. According to the company, it is the world’s first automotive-grade, wafer-level camera.

The OVM9284 is built on OmniVision’s OmniPixel3-GS global-shutter pixel architecture, which provides quantum efficiency at the 940nm wavelength for high quality driver images in near or total darkness. The integrated OmniVision image sensor has a 3 micron pixel and a 1/4" optical format, along with 1280 x 800 resolution.

This 1 megapixel (MP) module has a compact size of 6.5 x 6.5mm to provide driver monitoring system (DMS) designers with flexibility on placement within the cabin while remaining hidden from view. According to the company, it has the lowest power consumption among automotive camera modules, which enables it to run continuously in tight spaces and at low temperatures for maximum image quality.

All CameraCubeChip modules are reflowable. This means they can be mounted to a printed circuit board simultaneously with other components using automated surface-mount assembly equipment.

A virtual demo and Q&A for the OVM9284 will be available at AutoSensONLINE’s virtual demo sessions, on Friday, June 12th at 10:40am (Eastern). Register for free, here: https://auto-sens.com/autosens-online-tickets.

OVM9284 module samples are available now, and mass production is expected in Q4 of 2020. For more information, visit: https://www.ovt.com/

About the Author

Tiera Oliver, edtorial intern for Embedded Computing Design, is responsible for web content edits as well as newsletter updates. She also assists in news content as far as constructing and editing stories. Before interning for ECD, Tiera had recently graduated from Northern Arizona University where she received her B.A. in journalism and political science and worked as a news reporter for the university's student led newspaper, The Lumberjack.

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