Modular Embedded PC with Apollo Lake Power and PoE functionality

December 2, 2019 Perry Cohen

The new MB1-10AP Embedded PC, from ICP Deutschland GmbH, is the basic model of the new modular M-Series. It particularly compact in a 1.5 litre housing and modular due to its i-expansion solution. The MB1-10AP is available in four versions. Two of the versions are available with power over ethernet functionality and two are available with normal network interfaces. Additionally, consumers can choose from two processor types; the Intel Pentium N4200 four-core processor with maximum 2.5GHz and the Celeron N3350 two-core processor with maximum 2.4GHz.

All variants support up to 8GB DDR3L SO-DIMM memory with a frequency of 1867 MHz. The standard versions include HDMI, two Intel i210-IT and one Realtek RTL8154 Gigabit network interface, two serial RS-232/422/485 interfaces, four USB3.0 ports as well as MIC-IN and LINE-OUT. With the two PoE variants, the adaptation of the two Intel I210 interfaces from the MB1-10AP to a small, compact PSE device.

As optional expansion modules, ICP offers a VGA,  DVI-D, and display port modules for the connection of monitors. Also available is a dual RS-232/422/485 module with 5VDC/12VDC voltage output and an 8-bit IO module with four isolated digital inputs and four isolated outputs. The MB1-10AP offers two full-size Mini PCIe slots for the expansion of fieldbus or WLAN cards. For mass storage the MB1-10AP offers a 2.5" slot with SATA-6G connection as well as mSATA functionality on the Mini-PCIe slot. 

The voltage input supports a range from 8 to 24VDC, and is industrially designed with reverse power control, over-voltage and overcurrent protection as well as ESD and surge protection. The model variants with PoE are designed for a temperature range from -25 °C to 60 °C, whereby the variants without PoE can be operated at up to 70 °C. The PoE versions are available in a wide range of temperatures.

For more information, visit


About the Author

Perry Cohen

Perry Cohen, associate editor for Embedded Computing Design, is responsible for web content editing and creation in addition to podcast production. He also assists with the publication’s social media efforts which include strategic posting, follower engagement, and social media analysis. Before joining the ECD editorial team, Perry has been published on both local and national news platforms including (Phoenix), (Phoenix),, Cronkite News, and MLB/MiLB among others. Perry received a BA in Journalism from the Walter Cronkite School of Journalism and Mass Communications at Arizona State university. He can be reached by email at <a href=""></a>. Follow Perry’s work and ECD content on his twitter account @pcohen21.

Follow on Twitter Follow on Linkedin More Content by Perry Cohen
Previous Article
Smart Equipment Technology (SET) Introduces New Automatic Flip-Chip Bonder for Device Production
Smart Equipment Technology (SET) Introduces New Automatic Flip-Chip Bonder for Device Production

Smart Equipment Technology, a supplier in die-to-die and die-to-wafer bonders, announced the release of NEO...

Next Article
Scenes From the European Xilinx Developer Forum
Scenes From the European Xilinx Developer Forum

Held on three continents, America, Europe, and Asia, the forum brings together Xilinx engineers, solution d...