MediaTek’s Helio P70 Hits the Market

November 20, 2018 Laura Dolan

MediaTek has launched the Helio P70 system-on-chip (SoC). It features CPU and GPU upgrades with a heightened AI engine, which garners improved imaging and camera support, better gaming performance and connectivity.

The Helio P70 was manufactured with TSMC’s 12nm FinFET technology, which features a multi-core APU running at a rate of 525 MHz for precise edge-AI processing. The chipset has four Arm Cortex-A73 2.1 GHz processors and four Arm Cortex-A53 2.0 GHz processors in an octa-core big.LITTLE configuration. Supplemental power comes from an improved Arm Mali-G72 MP3 GPU running up to 900 MHz, offering a 13 percent performance improvement compared to its former counterpart, Helio P60.

“With an enhanced AI engine that works seamlessly across the CPU and GPU, Helio P70 delivers much faster performance for AI applications and is still highly power efficient,” said TL Lee, General Manager of MediaTek’s Wireless Communication business unit. “The introduction of Helio P70 continues MediaTek’s commitment to deliver high-end smartphone features and advanced technology for the mass market.”

For more information, visit www.mediatek.com.

Previous Article
FTDI Chip’s Latest Controller IC Delivers 3A Current

FTDI Chip debuted its FT4233H at Electronica. It is an advanced bridge IC with USB Type-C connectivity and ...

Next Article
Syslogic introduces AI Embedded Computer at SPS IPC Drives

Syslogic will be presenting its brand new AI Embedded Computer at the Industrial Automation trade show SPS ...